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Sockets for ICs, Transistors

26,642 products
Mfr Part # Qty Price Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
346-93-124-41-013000
CONN SOCKET SIP 24POS GOLD
Mill-Max Manufacturing Corp.
9,693 4.77000 Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
4828-6000-CP
CONN IC DIP SOCKET 28POS TIN
3M
5,168 0.98000 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C Details
ED028PLCZ
CONN SOCKET PLCC 28POS TIN
On Shore Technology Inc.
7,152 0.58960 Active PLCC 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C Details
612-87-420-41-001101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
7,286 1.40210 Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
117-83-642-41-005101
CONN IC DIP SOCKET 42POS GOLD
Preci-Dip
3,788 2.47640 Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
114-83-324-41-117101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
5,026 1.46080 Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
32-6574-11
CONN IC DIP SOCKET ZIF 32POS TIN
Aries Electronics
1,667 25.45200 Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled - Details
116-83-328-41-004101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
2,797 4.66350 Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
117-87-642-41-005101
CONN IC DIP SOCKET 42POS GOLD
Preci-Dip
120 2.84000 Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
2-644018-4
CONN IC DIP SOCKET 32POS GOLD
TE Connectivity AMP Connectors
28 1.88000 Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic -55°C ~ 125°C Details
110-93-432-41-001000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
46 17.18000 Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
346-43-137-41-013000
CONN SOCKET SIP 37POS GOLD
Mill-Max Manufacturing Corp.
7,274 7.06000 Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
299-93-310-11-001000
CONN IC DIP SOCKET 10POS GOLD
Mill-Max Manufacturing Corp.
457 4.14000 Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
121-83-314-41-001101
CONN IC DIP SOCKET 14POS GOLD
Preci-Dip
6,247 1.32390 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
614-87-628-31-012101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
72 2.99000 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
116-83-432-41-007101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
4,707 3.77710 Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
214-44-632-01-670800
CONN IC DIP SOCKET 32POS TIN
Mill-Max Manufacturing Corp.
5,354 3.17000 Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
ICA-314-SGT
CONN IC DIP SOCKET 14POS GOLD
Samtec Inc.
69 3.79000 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C Details
116-87-320-41-009101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
6,918 1.76350 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
2-822114-3
CONN SOCKET PQFP 144POS TIN-LEAD
TE Connectivity AMP Connectors
451 30.47000 Obsolete QFP 144 (4 x 36) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP) - Details
114-83-628-41-117101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
2,738 1.82180 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
110-99-310-41-001000
CONN IC DIP SOCKET 10POS TINLEAD
Mill-Max Manufacturing Corp.
8,692 11.04380 Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
116-83-324-41-004101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
3,751 4.24720 Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
299-83-312-11-001101
CONN IC DIP SOCKET 12POS GOLD
Preci-Dip
2,889 2.33130 Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details

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