Sockets for ICs, Transistors

Mfr Part #	Qty	Price	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
116-83-424-41-003101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	8,652	2.39320	Active	DIP, 0.4" (10.16mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
117-87-620-41-105101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	2,778	1.36100	Active	DIP, 0.6" (15.24mm) Row Spacing	20 (2 x 10)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
117-87-316-41-105101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	9,851	1.05150	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.070" (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
116-83-310-41-004101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	4,421	1.56150	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
D2928-42 CONN IC DIP SOCKET 28POS GOLD Harwin Inc.	266	3.11000	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Plastic	-55°C ~ 125°C	Details
110-83-210-01-742101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	5,110	0.62060	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5), 6 Loaded	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
116-87-628-41-006101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	4,636	1.56590	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
115-47-316-41-001000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	575	1.36000	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
117-83-448-41-005101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	3,201	2.82960	Active	DIP, 0.4" (10.16mm) Row Spacing	48 (2 x 24)	0.070" (1.78mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
116-87-310-41-008101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	6,095	0.83630	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
441-PRS21001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	96	164.97000	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C	Details
116-83-320-41-006101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	7,371	1.49540	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
115-83-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	1,890	0.32840	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
116-87-632-41-012101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	1,204	2.45250	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
121-83-308-41-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	7,935	0.75660	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
714-43-162-31-018000 CONN SOCKET SIP 62POS GOLD Mill-Max Manufacturing Corp.	4,017	16.03000	Active	SIP	62 (1 x 62)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
117-83-428-41-005101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	9,779	1.59410	Active	DIP, 0.4" (10.16mm) Row Spacing	28 (2 x 14)	0.070" (1.78mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
NTE435K52 SOCKET-52 PIN DIP .070 NTE Electronics, Inc	1,116	3.43000	Active	DIP, 0.698" (17.72mm) Row Spacing	52 (2 x 26)	-	-	-	-	Through Hole	-	Solder	0.070" (1.78mm)	-	-	-	-	-	Details
116-87-308-41-009101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	5,030	0.70550	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
116-87-642-41-011101 CONN IC DIP SOCKET 42POS GOLD Preci-Dip	9,064	5.30820	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
808-AG11D CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	5,658	2.62000	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	80.0µin (2.03µm)	Copper Alloy	Polyester	-55°C ~ 105°C	Details
208-7391-55-1902 CONN SOCKET SOIC 8POS GOLD 3M	327	33.65000	Active	SOIC	8 (2 x 4)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C	Details
110-87-210-01-742101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	6,077	0.48390	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5), 6 Loaded	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
24-C182-10 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	174	6.98000	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	Details

RFQ List

Sockets for ICs, Transistors

Looking for Sockets for ICs, Transistors?

Company

Products & Resources

Help & Policies

Live Chat