Sockets for ICs, Transistors

Mfr Part #	Qty	Price	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
410-87-228-10-002101 CONN ZIG-ZAG 28POS GOLD Preci-Dip	1,899	1.29690	Active	Zig-Zag, Right Stackable	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
917-43-103-41-001000 CONN TRANSIST TO-5 3POS GOLD Mill-Max Manufacturing Corp.	3,799	1.87000	Active	Transistor, TO-5	3 (Round)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	-	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
110-43-328-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	2,994	2.66000	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
116-87-624-41-001101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	4,234	2.73730	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
ICF-308-S-O CONN IC DIP SOCKET 8POS TIN Samtec Inc.	50	3.96000	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C	Details
299-87-622-10-002101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	6,225	5.52700	Active	DIP, 0.6" (15.24mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
299-83-320-10-001101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	5,107	4.12370	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
116-83-312-41-018101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	3,741	0.94140	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
410-83-220-10-001101 CONN ZIG-ZAG 20POS GOLD Preci-Dip	9,550	1.40420	Active	Zig-Zag, Left Stackable	20 (2 x 10)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
210-13-324-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	8,568	14.43310	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
10-6513-10T CONN IC DIP SOCKET 10POS GOLD Aries Electronics	2,482	1.91090	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C	Details
111-47-306-41-001000 CONN IC DIP SOCKET 6POS GOLD Mill-Max Manufacturing Corp.	304	0.73000	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
116-83-324-41-007101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	9,909	2.58270	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
248-5205-01 CONN SOCKET QFN 48POS GOLD 3M	20	121.22000	Active	QFN	48 (4 x 12)	0.020" (0.50mm)	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-	Details
116-83-312-41-008101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	2,572	1.29020	Active	DIP, 0.3" (7.62mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
115-87-310-41-003101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	8,730	0.42600	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
69802-044LF CONN SOCKET PLCC 44POS TIN Amphenol ICC (FCI)	5,333	2.64000	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 125°C	Details
115-87-306-41-003101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	6,950	0.25550	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
4-1571551-9 CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	340	4.73000	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Nickel	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
116-87-648-41-006101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	4,515	3.14660	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
NTE435P18 SOCKET FOR 18 PIN DIP NTE Electronics, Inc	850	0.36000	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	-	-	Details
299-93-630-10-002000 CONN IC DIP SOCKET 30POS GOLD Mill-Max Manufacturing Corp.	50	13.14000	Active	DIP, 0.6" (15.24mm) Row Spacing	30 (2 x 15)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
382 CONN IC DIP SOCKET 28POS Adafruit Industries LLC	103	3.00000	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	-	-	-	-	-	-	-	-	-	-	-	-	-	Details
110-13-324-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	1,815	3.42000	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details

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