| Mfr Part # | Qty | Price | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
70-0202-0610
SOLDER PASTE NO CLEAN 500GM
Kester Solder
|
7,132 | 137.36000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
91-6337-8843
SOLDER FLUX-CORED/245 63/37 .015
Kester Solder
|
3,431 | 42.78760 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | - | Leaded | Spool, 8.8 oz (250g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
92-7058-8842
SOLDER FLUX-CORED/245 .025" 500G
Kester Solder
|
8,665 | 146.91460 | Active | Wire Solder | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | 0.025" (0.64mm) | 423°F (217°C) | No-Clean | 22 AWG, 23 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMDBI100-S-16
SOLDER SHOT BI100 16OZ 454G
Chip Quik Inc.
|
3,219 | 34.00000 | Active | Solder Shot | Bi100(100) | - | 521°F (271°C) | - | - | - | Lead Free | Bag, 1 lb (454g) | - | - | - | Details |
|
RC9601062PSAC
SAC 305 ROSIN FLUX 1 LB. 062 DIA
Canfield Technologies
|
50 | 86.33000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
70-1903-0810
SOLDER 500G JAR,SN96.5 AG3.0
Kester Solder
|
1,668 | 176.75000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
24-7150-8834
SOLDER FLUX-CORED/245 .020 1LB S
Kester Solder
|
8,194 | 74.09360 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
CWSN60WRAP3 .032
SN60PB40 WRAP3 .032 DIA 1# SPL
Amerway Inc
|
50 | 47.21000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032" (0.81mm) | - | - | - | - | - | Spool, 1 lb (453.59g) | - | - | - | Details |
|
SSLTNC-50G
LOW TEMPERATURE LEAD FREE SOLDER
SRA Soldering Products
|
3 | 20.99000 | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
70-2002-0611
SOLDER PASTE WATER SOLUBLE 600GM
Kester Solder
|
2,292 | 213.28800 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
SSLFNC-T5-35G
SAC 305 LEAD FREE SOLDER PASTE T
SRA Soldering Products
|
1,842 | 32.99000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
96-7069-9531
SN96.5AG3.0CU0.5 3.3%/268 .031 5
Kester Solder
|
61 | 133.29000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
TS391SNL
THERMALLY STABLE SOLDER PASTE NO
Chip Quik Inc.
|
38 | 16.95000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | Details |
|
T0051404799
WSW SCN M1 SN0,6CU0,05NI3,5%
Apex Tool Group
|
29 | 21.50000 | Active | Wire Solder | Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | 0.020" (0.51mm) | - | No-Clean | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - | Details |
|
TS391LT50
THERMALLY STABLE SOLDER PASTE NO
Chip Quik Inc.
|
47 | 21.95000 | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | Details |
|
92-7068-6403
SOLDER FLUX-CORED/331 .031" 500G
Kester Solder
|
4,274 | 135.20670 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
WBENVIRO
MADE IN USA ENVIROSAFE BAR
SRA Soldering Products
|
23 | 69.99000 | Active | Bar Solder | Sn96.5Cu3.45Sb1Ag0.05 (96.5/3.45/1/0.05) | - | 430°F (221°C) | - | - | - | Lead Free | Bar, 1 lb (453.59g) | - | - | - | Details |
|
4884-227G
SOLDER RA 63/37 .025" 1/2 LBS
MG Chemicals
|
9 | 36.38000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | 60 Months | - | - | Details |
|
24-4060-8290
SOLDER FLUX-CORED/88 .020" 1LB S
Kester Solder
|
1,287 | 75.59250 | Active | Wire Solder | Pb60Sn40 (60/40) | 0.020" (0.51mm) | 361 ~ 460°F (183 ~ 238°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD2040
SOLDER SPHERES SAC305 .020 DIAM
Chip Quik Inc.
|
8,741 | 120.95000 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - | Details |
|
SSLTNC-T5-250G
LOW TEMPERATURE LEAD FREE SOLDER
SRA Soldering Products
|
8 | 79.99000 | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
CWSN60 NCCW2.2 .015
SN60PB40 NCCW2.2% .015 !# SPL
Amerway Inc
|
50 | 56.15000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | - | - | - | - | - | Spool, 1 lb (453.59g) | - | - | - | Details |
|
25-7068-1404
SOLDER FLUX-CORED/48 .050 4 LB S
Kester Solder
|
8,974 | 331.44160 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.050" (1.27mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Lead Free | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD3SW.031 8OZ
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Chip Quik Inc.
|
10 | 45.32000 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - | Details |
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