| Mfr Part # | Qty | Price | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDSWLT.047 1OZ
SOLDER WIRE SN42/BI57/AG1 .047"
Chip Quik Inc.
|
12 | 16.31000 | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.047" (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 1 oz (28.35g) | - | - | - | Details |
|
SMD2SW.031 2OZ
SOLDER WIRE 60/40 TIN/LEAD NO-CL
Chip Quik Inc.
|
8 | 10.08000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 2 oz (56.70g) | - | - | - | Details |
|
SMD2205-25000
SOLDER SPHERES SN63/PB37 .025" D
Chip Quik Inc.
|
16 | 16.39000 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - | Details |
|
24-7050-0075
SOLDER FLUX-CORED/44 .031" 1LB S
Kester Solder
|
5,800 | 123.61190 | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.031" (0.79mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6040-0053
SOLDER RA FLUX 16AWG 60/40 1LB
Kester Solder
|
283 | 55.49000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.050" (1.27mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
WC9601031P
SAC 305 WATER SOLUBLE FLUX 1 LB.
Canfield Technologies
|
50 | 89.39000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
92-7068-8820
SOLDER FLUX-CORED/245 .020 500G
Kester Solder
|
7,450 | 129.48000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD2SWLF.031 4OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Chip Quik Inc.
|
2 | 25.72000 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - | Details |
|
24-7068-7606
SOLDER NO-CLEAN .050" 16AWG 1LB
Kester Solder
|
137 | 111.36000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.050" (1.27mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 16 AWG, 18 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
NC191AX500C
SMOOTH FLOW LEADED SOLDER PASTE
Chip Quik Inc.
|
8 | 89.90000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
CWSAC WRMAP .015
SN96.5AG3CU.5 WRMAP3 .015 1# SPL
Amerway Inc
|
46 | 114.98000 | Active | Wire Solder | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | 0.015" (0.38mm) | - | - | - | - | - | Spool, 1 lb (453.59g) | - | - | - | Details |
|
SMD2165-25000
SOLDER SPHERES SN63/PB37 .012" D
Chip Quik Inc.
|
13 | 20.59000 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.012" (0.31mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - | Details |
|
25-9574-1400
SOLDER FLUX-CORED/48 .062" 4 LB
Kester Solder
|
7,855 | 198.75200 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.062" (1.57mm) | 441°F (227°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
92-7068-8845
SOLDER FLUX-CORED/245 .015" 500G
Kester Solder
|
7,201 | 184.66840 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 27 AWG, 28 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
70-0202-0519
SOLDER PASTE NO CLEAN 750GM
Kester Solder
|
8,440 | 201.17700 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Cartridge, 24.69 oz (700g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
4900P-250G
LEADED NO CLEAN SOLDER PASTE
MG Chemicals
|
6,782 | 106.77000 | Active | Solder Paste | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | - | 423 ~ 430°F (217 ~ 221°C) | No-Clean | - | - | Lead Free | Jar, 8.8 oz (250g) | 24 Months | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) | Details |
|
92-7150-8800
SOLDER FLUX-CORED/245 .031" 500G
Kester Solder
|
3,113 | 100.04050 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 22 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6337-8853
SOLDER FLUX-CORED/245 63/37 .015
Kester Solder
|
1,047 | 59.38800 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
RASWLF.020 1LB
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Chip Quik Inc.
|
9,149 | 95.67000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - | Details |
|
24-6337-7403
SOLDER FLUX-CORED/282 63/37 .062
Kester Solder
|
9,851 | 82.67660 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - | Details |
|
SMD2016
SOLDER SPHERES SN96.5/AG3.0/CU0.
Chip Quik Inc.
|
1 | 126.95000 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008" (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - | Details |
|
70-5306-2410
NP510-LT HRL1 T4 88% 500G JAR
Kester Solder
|
1,574 | 168.16000 | Active | Solder Paste | - | - | 212°F (100°C) | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
70-0102-0510
SOLDERPASTE NO CLEAN 63/37 500GM
Kester Solder
|
4,644 | 113.12000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
SMDLTLFP60T4
SN42/BI57.6/AG0.4 2-PART MIX 60G
Chip Quik Inc.
|
1 | 40.95000 | Active | Solder Paste, Two Part Mix | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 2.12 oz (60g) | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | Details |
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