| Mfr Part # | Qty | Price | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NC191LTA15
SMOOTH FLOW LOW TEMP SOLDER PAST
Chip Quik Inc.
|
7,309 | 10.95000 | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 4 | - | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
NC2SWLF.015 1LB
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Chip Quik Inc.
|
31 | 65.31000 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean | - | - | - | Spool, 1 lb (453.592g) | - | - | - | Details |
|
WC6001062P
60SN/40PB WATER SOLUBLE 1 LB .06
Canfield Technologies
|
50 | 40.02000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
SSLFWS-35G
SOLDER PASTE WATER SOLUBLE SAC30
SRA Soldering Products
|
5,879 | 24.99000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | Rosin Mildly Activated (RMA), Water Soluble | - | 3 | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) | Details |
|
RCESZ2062E
.062 SAC 305 RC 1 OZ COILS
Canfield Technologies
|
50 | 22.03000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
SMD2SWLF.015 8OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Chip Quik Inc.
|
5 | 39.19000 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - | Details |
|
44-7070-0000
SOLDER BAR 1.66LB
Kester Solder
|
6,544 | 237.21350 | Active | Bar Solder | Sn95Ag5 (95/5) | - | 430 ~ 473°F (221 ~ 245°C) | - | - | - | Lead Free | Bar, 1.66 lbs (750g) | - | - | - | Details |
|
SMD2SW.020 1OZ
SOLDER WIRE 60/40 TIN/LEAD NO-CL
Chip Quik Inc.
|
18 | 7.61000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 1 oz (28.35g) | - | - | - | Details |
|
CC96L2062E
SAC 305 NO CLEAN FLUX 8 OZ .062
Canfield Technologies
|
50 | 49.16000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
70-4021-0819
SOLDER PASTE NO CLEAN 750GM
Kester Solder
|
1,385 | 242.21800 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Cartridge, 24.69 oz (700g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
24-7068-7603
SOLDER NO-CLEAN .020" 24AWG 1LB
Kester Solder
|
775 | 117.81000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6040-9703
SOLDER FLUX-CORED/285 .015" 1LB
Kester Solder
|
90 | 74.33000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMDLTLFP500T5C
SOLDER PASTE LOW TEMP T5 500G
Chip Quik Inc.
|
4,504 | 210.00000 | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
24-0063-0010
SOLDER RA 63/36.65/0.35 0.02"
Kester Solder
|
8,382 | 67.16500 | Active | Wire Solder | Sn63Pb36.65Sb0.35 (63/36.65/0.35) | 0.020" (0.51mm) | - | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - | Details |
|
16-6337-0062
SOLDER 63/37 14AWG 5LB
Kester Solder
|
8,053 | 192.23330 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.062" (1.57mm) | 361°F (183°C) | - | 14 AWG, 16 SWG | - | Leaded | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-4060-0066
SOLDER FLUX-CORED/44 .093" 1LB S
Kester Solder
|
1,947 | 38.78720 | Active | Wire Solder | Pb60Sn40 (60/40) | 0.093" (2.36mm) | 361 ~ 460°F (183 ~ 238°C) | Rosin Activated (RA) | 11 AWG, 13 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
WBNCC633720-4OZ
NO-CLEAN FLUX CORE SOLDER, 63/37
SRA Soldering Products
|
4 | 14.99000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 4 oz (113.40g) | - | - | - | Details |
|
WC60L2062P
60SN/40PB WATER SOLUBLE 8 OZ .06
Canfield Technologies
|
50 | 27.60000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
96-7068-8832
SOLDER FLUX-CORED/245 .031" 500
Kester Solder
|
9,518 | 120.51520 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
17553
SOLDER 1.2MM 100G
Aven Tools
|
6,984 | 13.18000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.047" (1.19mm) | 360°F (180°C) | Rosin Activated (RA) | 17 AWG, 18 SWG | - | Leaded | Spool, 3.53 oz (100g) | - | - | - | Details |
|
92-7068-8860
SOLDER FLUX-CORED/245 .025" 500G
Kester Solder
|
1,979 | 113.76120 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025" (0.64mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 22 AWG, 23 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
JPAGSC0501P
SIL CAN 5 BRAZING ALLOY
Canfield Technologies
|
50 | 64.30000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
17552LF
SOLDER IN TUBE 1.2MM LEAD FREE
Aven Tools
|
5,639 | 5.20000 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.047" (1.19mm) | 440°F (227°C) | Rosin Activated (RA) | 17 AWG, 18 SWG | - | Lead Free | Tube, 0.71 oz (20g) | - | - | - | Details |
|
SMDPB100-S-16
SOLDER SHOT PB100 16OZ 454G
Chip Quik Inc.
|
8,649 | 10.00000 | Active | Solder Shot | Pb100(100) | - | 622°F (328°C) | - | - | - | Leaded | Bag, 1 lb (454g) | - | - | - | Details |
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