| Mfr Part # | Qty | Price | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
54020-44030LF
CONN SOCKET PLCC 44POS TIN
Amphenol ICC (FCI)
|
3,083 | 2.57000 | Active | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyphenylene Sulfide (PPS) | -40°C ~ 105°C | Details |
|
116-83-328-41-007101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
|
4,300 | 3.30490 | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
116-87-424-41-002101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
|
7,815 | 2.08240 | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
D95040-42
CONN IC DIP SOCKET 42POS GOLD
Harwin Inc.
|
9,609 | 5.47920 | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | -55°C ~ 125°C | Details |
|
116-87-652-41-009101
CONN IC DIP SOCKET 52POS GOLD
Preci-Dip
|
3,547 | 5.37540 | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
917-83-210-41-053101
CONN TRANSIST TO-5 10POS GOLD
Preci-Dip
|
1,997 | 1.45180 | Active | Transistor, TO-5 | 10 (Round) | - | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | - | Solder | - | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
299-87-608-10-002101
CONN IC DIP SOCKET 8POS GOLD
Preci-Dip
|
6,684 | 1.75870 | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
D01-9972142
CONN SOCKET SIP 21POS GOLD
Harwin Inc.
|
3,058 | 0.97900 | Active | SIP | 21 (1 x 21) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | -55°C ~ 125°C | Details |
|
110-93-308-41-001000
CONN IC DIP SOCKET 8POS GOLD
Mill-Max Manufacturing Corp.
|
2,672 | 0.95000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
108-PRS12005-12
CONN SOCKET PGA ZIF GOLD
Aries Electronics
|
4,785 | 81.03000 | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | Details |
|
116-83-420-41-002101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
|
9,403 | 2.24210 | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
917-43-208-41-001000
CONN SOCKET TRANSIST TO-100 8POS
Mill-Max Manufacturing Corp.
|
4,869 | 1.82760 | Active | Transistor, TO-100 | 8 (Round) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
4818-3000-CP
CONN IC DIP SOCKET 18POS TIN
3M
|
2,769 | 0.76000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C | Details |
|
117-87-640-41-105101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
|
6,744 | 2.91030 | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.070" (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
SA286040
CONN IC DIP SOCKET 28POS GOLD
On Shore Technology Inc.
|
431 | 1.39000 | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C | Details |
|
110-13-314-41-001000
CONN IC DIP SOCKET 14POS GOLD
Mill-Max Manufacturing Corp.
|
4,646 | 2.18000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
22-4518-10
CONN IC DIP SOCKET 22POS GOLD
Aries Electronics
|
2,042 | 3.28000 | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | Details |
|
116-83-316-41-002101
CONN IC DIP SOCKET 16POS GOLD
Preci-Dip
|
6,299 | 1.67780 | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
DILB28P-223TLF
CONN IC DIP SOCKET 28POS TIN
Amphenol ICC (FCI)
|
6,911 | 0.96000 | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 105°C | Details |
|
146-43-308-41-013000
CONN IC DIP SOCKET 8POS GOLD
Mill-Max Manufacturing Corp.
|
6,134 | 1.37210 | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
115-47-324-41-003000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
|
4,780 | 13.22050 | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
121-83-422-41-001101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
|
6,906 | 2.30320 | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
110-93-650-41-105000
CONN IC DIP SOCKET 50POS GOLD
Mill-Max Manufacturing Corp.
|
7,361 | 15.63930 | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
84-537-21
CONN SOCKET PLCC ZIF 84POS GOLD
Aries Electronics
|
1 | 316.53000 | Active | PLCC, ZIF (ZIP) | 84 (4 x 21) | 0.100" (2.54mm) | Gold | 12.0µin (0.30µm) | - | Surface Mount | Closed Frame | - | - | - | - | - | - | - | Details |
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