CONN IC DIP SOCKET 28POS TIN
DILB28P-223TLF is a Sockets for ICs, Transistors manufactured by Amphenol ICC (FCI). CONN IC DIP SOCKET 28POS TIN. Key specifications: mounting type Through Hole, operating temperature -55°C ~ 105°C, housing material Polyamide (PA), Nylon, termination Solder.
In Stock: 6,911
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin |
| Contact Finish Thickness - Mating | 100.0µin (2.54µm) |
| Contact Material - Mating | Copper Alloy |
| Mounting Type | Through Hole |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 100.0µin (2.54µm) |
| Contact Material - Post | Copper Alloy |
| Housing Material | Polyamide (PA), Nylon |
| Operating Temperature | -55°C ~ 105°C |
Submit your RFQ for DILB28P-223TLF and get a quote within 24 hours.
3J LIMITED
