| Mfr Part # | Qty | Price | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-87-640-41-003101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
|
7,197 | 2.95110 | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
116-87-432-41-001101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
|
8,627 | 3.64960 | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
210-99-624-41-001000
CONN IC DIP SOCKET 24POS TINLEAD
Mill-Max Manufacturing Corp.
|
4,908 | 12.63330 | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
116-87-640-41-004101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
|
4,169 | 7.00720 | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
110-93-428-41-105000
CONN IC DIP SOCKET 28POS GOLD
Mill-Max Manufacturing Corp.
|
5,095 | 14.84860 | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
110-83-648-41-005101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
|
8,301 | 3.24100 | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
917-43-210-41-001000
CONN SOCKET TRANSIST TO100 10POS
Mill-Max Manufacturing Corp.
|
6,587 | 2.08740 | Active | Transistor, TO-100 | 10 (Round) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
115-93-324-41-001000
CONN IC DIP SOCKET 24POS GOLD
Mill-Max Manufacturing Corp.
|
75 | 2.96000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
116-83-648-41-011101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
|
4,262 | 7.30840 | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
116-83-308-41-012101
CONN IC DIP SOCKET 8POS GOLD
Preci-Dip
|
8,932 | 0.75650 | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
24-6554-10
CONN IC DIP SOCKET ZIF 24POS TIN
Aries Electronics
|
87 | 13.33000 | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | Details |
|
714-43-119-31-018000
CONN SOCKET SIP 19POS GOLD
Mill-Max Manufacturing Corp.
|
9,507 | 5.58000 | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
116-87-432-41-004101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
|
9,773 | 4.63600 | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
346-93-140-41-013000
CONN SOCKET SIP 40POS GOLD
Mill-Max Manufacturing Corp.
|
6,666 | 7.64000 | Active | SIP | 40 (1 x 40) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
116-93-308-41-007000
CONN IC DIP SOCKET 8POS GOLD
Mill-Max Manufacturing Corp.
|
1,264 | 15.98000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
116-87-318-41-013101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
|
7,302 | 3.88020 | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
4828-6004-CP
CONN IC DIP SOCKET 28POS TIN
3M
|
2,548 | 1.00000 | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C | Details |
|
116-87-318-41-006101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
|
3,643 | 1.00640 | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
110-41-632-41-001000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
|
96 | 2.72000 | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
BU160Z-178-HT
CONN IC DIP SOCKET 16POS GOLD
On Shore Technology Inc.
|
5 | 2.37000 | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C | Details |
|
08-3518-10T
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
|
455 | 0.85000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | Details |
|
115-87-632-41-001101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
|
8,824 | 1.45350 | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
4-1571552-6
CONN IC DIP SOCKET 20POS GOLD
TE Connectivity AMP Connectors
|
1,795 | 3.95000 | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C | Details |
|
240-5205-01
CONN SOCKET QFN 40POS GOLD
3M
|
67 | 113.04000 | Active | QFN | 40 (4 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - | Details |
Submit your RFQ and our team will source it for you.
3J LIMITED