| Mfr Part # | Qty | Price | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4820-3004-CP
CONN IC DIP SOCKET 20POS TIN
3M
|
1,079 | 0.79000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C | Details |
|
123-43-320-41-001000
CONN IC DIP SOCKET 20POS GOLD
Mill-Max Manufacturing Corp.
|
50 | 4.92000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
116-87-328-41-011101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
|
6,054 | 3.53840 | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
311-93-120-41-001000
SOCKET LONG SOLDERTAIL SIP 20POS
Mill-Max Manufacturing Corp.
|
3,888 | 13.92840 | Active | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
116-83-210-41-003101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
|
8,826 | 1.14040 | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
116-87-650-41-013101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
|
4,500 | 10.77820 | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
714-43-206-31-018000
CONN IC DIP SOCKET 6POS GOLD
Mill-Max Manufacturing Corp.
|
6,543 | 2.10000 | Active | DIP, 0.1" (2.54mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
115-47-316-41-003000
CONN IC DIP SOCKET 16POS GOLD
Mill-Max Manufacturing Corp.
|
6,961 | 12.67140 | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
117-93-656-41-005000
CONN IC DIP SOCKET 56POS GOLD
Mill-Max Manufacturing Corp.
|
73 | 8.50000 | Active | DIP, 0.6" (15.24mm) Row Spacing | 56 (2 x 28) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
612-83-306-41-001101
CONN IC DIP SOCKET 6POS GOLD
Preci-Dip
|
7,781 | 0.43510 | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
115-87-320-41-001101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
|
9,284 | 0.74820 | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
24-6574-11
CONN IC DIP SOCKET ZIF 24POS TIN
Aries Electronics
|
4,282 | 20.98250 | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | Details |
|
117-87-664-41-005101
CONN IC DIP SOCKET 64POS GOLD
Preci-Dip
|
6,591 | 2.94530 | Active | DIP, 0.6" (15.24mm) Row Spacing | 64 (2 x 32) | 0.070" (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
115-87-650-41-003101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
|
8,441 | 2.49740 | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
117-83-668-41-105101
CONN IC DIP SOCKET 68POS GOLD
Preci-Dip
|
1,235 | 6.63960 | Active | DIP, 0.6" (15.24mm) Row Spacing | 68 (2 x 34) | 0.070" (1.78mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
614-43-640-31-012000
CONN IC DIP SOCKET 40POS GOLD
Mill-Max Manufacturing Corp.
|
40 | 8.26000 | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
116-87-312-41-002101
CONN IC DIP SOCKET 12POS GOLD
Preci-Dip
|
4,150 | 0.97390 | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
117-83-430-41-105101
CONN IC DIP SOCKET 30POS GOLD
Preci-Dip
|
5,592 | 2.64590 | Active | DIP, 0.4" (10.16mm) Row Spacing | 30 (2 x 15) | 0.070" (1.78mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
NTE435P42
SOCKET-42 PIN DIP
NTE Electronics, Inc
|
67 | 1.61000 | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | - | - | - | - | Through Hole | - | Solder | 0.100" (2.54mm) | - | - | - | - | - | Details |
|
24-6518-10
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
|
60 | 2.67000 | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | Details |
|
BU14OZ-178-HT
CONN IC DIP SOCKET 14POS GOLD
On Shore Technology Inc.
|
53 | 1.47000 | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 125°C | Details |
|
299-93-312-10-001000
CONN IC DIP SOCKET 12POS GOLD
Mill-Max Manufacturing Corp.
|
124 | 5.52000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
8444-21B1-RK-TP
CONN SOCKET PLCC 44POS TIN
3M
|
3,609 | 2.14000 | Active | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C | Details |
|
116-83-210-41-008101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
|
5,253 | 1.07530 | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
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