| Mfr Part # | Qty | Price | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
115-93-422-41-003000
CONN IC DIP SOCKET 22POS GOLD
Mill-Max Manufacturing Corp.
|
1,948 | 2.50280 | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
110-87-610-41-005101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
|
5,618 | 0.34520 | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
2-2129710-8
CONN SOCKET LGA 3647POS GOLD
TE Connectivity AMP Connectors
|
40 | 37.37000 | Active | LGA | 3647 | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | - | - | Copper Alloy | Thermoplastic | - | Details |
|
116-87-648-41-013101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
|
7,949 | 10.34710 | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
383
40-PIN ZIF SOCKET
Adafruit Industries LLC
|
80 | 4.00000 | Active | DIP, ZIF (ZIP) | 40 (2 x 20) | - | Gold | - | - | Through Hole | Closed Frame | Solder | - | Gold | - | - | - | - | Details |
|
116-83-610-41-013101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
|
7,838 | 2.31380 | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
115-93-632-41-003000
CONN IC DIP SOCKET 32POS GOLD
Mill-Max Manufacturing Corp.
|
197 | 3.78000 | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
16-810-90C
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
|
43 | 12.69000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | Details |
|
116-83-432-41-011101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
|
3,369 | 4.72470 | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
116-87-420-41-002101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
|
2,239 | 1.73480 | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
105200-0008
5.50 BY 5.50MM CAMERA SOCKET, 3.
Molex
|
1,800 | 1.09000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
214-44-314-01-670800
CONN IC DIP SOCKET 14POS TIN
Mill-Max Manufacturing Corp.
|
11,922 | 1.62000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
122-83-420-41-001101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
|
2,650 | 1.89800 | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
116-87-642-41-007101
CONN IC DIP SOCKET 42POS GOLD
Preci-Dip
|
5,092 | 4.35380 | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
117-43-640-41-005000
CONN IC DIP SOCKET 40POS GOLD
Mill-Max Manufacturing Corp.
|
6,799 | 5.08150 | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070" (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
116-83-308-41-002101
CONN IC DIP SOCKET 8POS GOLD
Preci-Dip
|
6,329 | 0.81000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
115-87-610-41-001101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
|
1,611 | 0.38750 | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
346-93-152-41-013000
CONN SOCKET SIP 52POS GOLD
Mill-Max Manufacturing Corp.
|
7,517 | 9.51000 | Active | SIP | 52 (1 x 52) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
08-6810-90
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
|
7,430 | 9.51000 | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - | Details |
|
299-83-618-10-002101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
|
8,800 | 5.24500 | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
346-43-135-41-013000
CONN SOCKET SIP 35POS GOLD
Mill-Max Manufacturing Corp.
|
6,722 | 6.68000 | Active | SIP | 35 (1 x 35) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
|
4816-3004-CP
CONN IC DIP SOCKET 16POS TIN
3M
|
17,662 | 0.76000 | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C | Details |
|
116-83-328-41-008101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
|
8,549 | 3.21820 | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | Details |
|
210-99-316-41-001000
CONN IC DIP SOCKET 16POS TINLEAD
Mill-Max Manufacturing Corp.
|
8,635 | 12.22420 | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | Details |
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