| Mfr Part # | Qty | Price | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TS391AX500C
THERMALLY STABLE SOLDER PASTE NO
Chip Quik Inc.
|
3 | 97.50000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | Details |
|
24-6337-0027
SOLDER RA 20AWG 63/37 1LB
Kester Solder
|
253 | 61.86000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
14-6040-0125
SOLDER 60/40 8AWG 1LB
Kester Solder
|
2,660 | 34.17840 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.125" (3.18mm) | 361 ~ 374°F (183 ~ 190°C) | - | 8 AWG, 10 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMDSWLF.015 .3OZ
LF SOLDER WIRE POCKET PACK 96.5/
Chip Quik Inc.
|
9,802 | 12.99000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Tube, 0.3 oz (8.51g) | - | - | - | Details |
|
24-7070-0027
SOLDER FLUX-CORED/44 .031" 1LB S
Kester Solder
|
6,896 | 105.17330 | Active | Wire Solder | Sn95Ag5 (95/5) | 0.031" (0.79mm) | 430 ~ 473°F (221 ~ 245°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMDLTLFP500T3
SOLDER PASTE SN42/BI58 500G
Chip Quik Inc.
|
1,694 | 127.95000 | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
WBRASAC31-1LB
SOLDER ROSIN SAC305 .031 1 LB
SRA Soldering Products
|
10 | 84.99000 | Active | Wire Solder | - | 0.031" (0.79mm) | 423°F (217°C) | Rosin Activated (RA) | - | - | Lead Free | Spool, 1 lb (453.59g) | - | - | - | Details |
|
24-7150-9727
SOLDER FLUX-CORED/285 .015" 1LB
Kester Solder
|
23 | 126.05000 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.015" (0.38mm) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6337-8804
SOLDER FLUX-CORED/245 63/37 .062
Kester Solder
|
6,236 | 45.68440 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.062" (1.57mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6337-6403
SOLDER WATER SOLUABLE 20AWG 1LB
Kester Solder
|
187 | 57.47000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
70-1003-0610
SOLDER PASTE WATER SOLUBLE 500GM
Kester Solder
|
2,400 | 137.36000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
RASW.031 8OZ
SOLDER WIRE 63/37 TIN/LEAD ROSIN
Chip Quik Inc.
|
9 | 28.47000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - | Details |
|
24-7050-9709
SOLDER FLUX-CORED/285 .031" 1LB
Kester Solder
|
8,053 | 121.77370 | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.031" (0.79mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
70-4021-0811
SOLDER PASTE NO CLEAN 600GM
Kester Solder
|
6 | 184.22000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Cartridge, 21.16 oz (600g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
24-7050-9718
SOLDER FLUX-CORED/285 .025" 1LB
Kester Solder
|
4,009 | 105.88030 | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.025" (0.64mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
T0051386999
WSW SAC L0 SN3,0AG0,5CU3,5%
Apex Tool Group
|
2 | 124.00000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | - | No-Clean | - | - | Lead Free | Spool, 17.64 oz (500g) | - | - | - | Details |
|
70-2102-0310
SOLDER PASTE WATER SOLUBLE 500GM
Kester Solder
|
3,662 | 141.40000 | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
SMD2170
SOLDER SPHERES SN63/PB37 .014" (
Chip Quik Inc.
|
1 | 97.95000 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.014" (0.36mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - | Details |
|
WC60L2031
60SN/40PB WATER SOLUBLE FLUX 8 O
Canfield Technologies
|
50 | 30.27000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
WS991SNL500T4
SOLDER PASTE THERMALLY STABLE WS
Chip Quik Inc.
|
1,097 | 97.09000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - | Details |
|
44-6337-0050
SOLDR BAR ULTRAPURE 63/37 1.66LB
Kester Solder
|
277 | 94.11000 | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar, 1.66 lbs (750g) | - | - | - | Details |
|
25-7068-6411
SOLDER FLUX-CORED/331 .062" 4LB
Kester Solder
|
5,253 | 327.25600 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 14 AWG, 16 SWG | - | Lead Free | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
70-0605-0810
SOLDER PASTE NO CLEAN 500GM
Kester Solder
|
7,062 | 141.40000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
70-0403-0810
SOLDER PASTE WATER SOLUBLE 500GM
Kester Solder
|
1,112 | 153.52000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
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