| Mfr Part # | Qty | Price | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
24-6040-0017
SOLDER FLUX-CORED/44 .025" 1LB S
Kester Solder
|
8,890 | 64.36530 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.025" (0.64mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6337-8808
SOLDER FLUX-CORED/245 63/37 .020
Kester Solder
|
1,311 | 48.57090 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6040-0038
SOLDER FLUX-CORED/44 .024" 1LB S
Kester Solder
|
8,001 | 47.68010 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.040" (1.02mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
WC96L2062PSAC
SAC 305 WATER SOLUBLE FLUX 8 OZ.
Canfield Technologies
|
50 | 49.16000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
TS991SNL500T3
SOLDER PASTE THERMALLY STABLE NC
Chip Quik Inc.
|
1,454 | 107.19000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - | Details |
|
BARSN60PB40
SOLDER BAR SN60/PB40 1LB SUPER L
Chip Quik Inc.
|
14 | 28.78000 | Active | Bar Solder | Sn60Pb40 (60/40) | - | 361 ~ 370°F (183 ~ 188°C) | - | - | - | Leaded | Bar, 1 lb (454g) | - | - | - | Details |
|
CQ100GE.031 1LB
GERMANIUM DOPED SOLDER WIRE SN/C
Chip Quik Inc.
|
9 | 62.74000 | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | - | - | Lead Free | Spool, 1 lb (454 g) | - | - | - | Details |
|
14-7070-0020
SOLDER SOLID WIRE .020" 1LB SPL
Kester Solder
|
2,500 | 144.25630 | Active | Wire Solder | Sn95Ag5 (95/5) | 0.020" (0.51mm) | 430 ~ 473°F (221 ~ 245°C) | - | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-7050-9710
SOLDER FLUX-CORED/285 .031" 1LB
Kester Solder
|
8,805 | 124.62400 | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.031" (0.79mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
25-7080-0069
SOLDER FLUX-CORED/44 .125" 4LB S
Kester Solder
|
6,011 | 222.56360 | Active | Wire Solder | Sn95Sb5 (95/5) | 0.125" (3.18mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 8 AWG, 10 SWG | - | Lead Free | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMDSWLF.006 5G
SOLDER WIRE SN96.5/AG3/CU0.5
Chip Quik Inc.
|
22 | 29.99000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.176 oz (5g) | - | - | - | Details |
|
RC96L2020CQPJ
SAC 305 ROSIN FLUX 8 OZ. .020 DI
Canfield Technologies
|
50 | 56.55000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
NC191LT500C
SMOOTH FLOW LOW TEMP SOLDER PAST
Chip Quik Inc.
|
2,772 | 115.90000 | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | - | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
24-6337-7400
SOLDER FLUX-CORED/282 63/37.020"
Kester Solder
|
7,194 | 106.98320 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - | Details |
|
24-7068-7632
SOLDER FLUX-CORED/275 .093" 1LB
Kester Solder
|
8,201 | 82.88870 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.093" (2.36mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 11 AWG, 13 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD291SNL500T5
SOLDER PASTE SAC305 500G T5
Chip Quik Inc.
|
8,935 | 214.28000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
27-7080-2424
SOLDER ACID CORED .062" 18LB SPL
Kester Solder
|
8,493 | 1142.03090 | Active | Wire Solder | Sn95Sb5 (95/5) | 0.062" (1.57mm) | 450 ~ 464°F (232 ~ 240°C) | Acid Cored | 14 AWG, 16 SWG | - | Lead Free | Spool, 18 lbs (8.16kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMDSWLT.040 100G
SN42/BI57/AG1 2.2 FLUX CORE SOLD
Chip Quik Inc.
|
12 | 123.08000 | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 3.5 oz (100g) | - | - | - | Details |
|
SMD2SWLF.015 1LB
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Chip Quik Inc.
|
4 | 65.31000 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - | Details |
|
24-7080-9715
SOLDER FLUX-CORED/285 .050 1LB S
Kester Solder
|
1,124 | 64.81780 | Active | Wire Solder | Sn95Sb5 (95/5) | 0.050" (1.27mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Mildly Activated (RMA) | 16 AWG, 18 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
70-0202-0310
SOLDER PASTE NO CLEAN 500GM
Kester Solder
|
1,665 | 148.47000 | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | No-Clean | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
SSWS-15G
SOLDER PASTE WATER SOLUBLE 63/37
SRA Soldering Products
|
8,719 | 16.99000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | - | Water Soluble | - | 3 | - | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) | Details |
|
SMD291SNL50T3
SLDR PASTE NO-CLN SAC305 50G
Chip Quik Inc.
|
23 | 16.95000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
16-7050-0125
SOLDER SOLID WIRE .125" 5LB SPL
Kester Solder
|
9,755 | 560.22700 | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.125" (3.18mm) | 430 ~ 444°F (221 ~ 223°C) | - | 8 AWG, 10 SWG | - | Lead Free | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
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