| Mfr Part # | Qty | Price | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SSNC-35G
SOLDER PASTE NC 63/37 10CC SYRIN
SRA Soldering Products
|
4,896 | 19.99000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | - | No-Clean | - | 3 | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) | Details |
|
92-7068-8840
SOLDER FLUX-CORED/245 .0240" 500
Kester Solder
|
1,350 | 139.02450 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 18 AWG, 19 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6040-9718
SOLDER FLUX-CORED/285 .025" 1LB
Kester Solder
|
194 | 72.68000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.025" (0.64mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-7068-7605
SOLDER FLUX-CORED/275 .0240" 1LB
Kester Solder
|
3,490 | 85.17940 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 18 AWG, 19 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD2200-25000
SOLDER SPHERES SN63/PB37 .024" D
Chip Quik Inc.
|
5 | 16.39000 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.024" (0.61mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - | Details |
|
SMD2SWLF.015 2OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Chip Quik Inc.
|
6 | 16.98000 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - | - | Details |
|
CWSN63WRMAP3 .032
SN63PB37 WRMAP3 .032 DIA 1# SPL
Amerway Inc
|
50 | 47.21000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032" (0.81mm) | - | - | - | - | - | Spool, 1 lb (453.59g) | - | - | - | Details |
|
24-9574-7613
SOLDER 66 .050 16AWG 1LB
Kester Solder
|
7,155 | 49.09410 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.050" (1.27mm) | 441°F (227°C) | No-Clean | 16 AWG, 18 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD2170-25000
SOLDER SPHERES SN63/PB37 .014" (
Chip Quik Inc.
|
10 | 19.95000 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.014" (0.36mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - | Details |
|
70-0202-0511
SOLDER PASTE NO CLEAN 600GM
Kester Solder
|
1,676 | 135.74400 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
24-6337-8800
SOLDER NO-CLEAN 20AWG 1LB
Kester Solder
|
190 | 59.75000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6337-8802
SOLDER NO-CLEAN 20AWG 63/37 1LB
Kester Solder
|
145 | 60.47000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
RCBLF227L2062E
BLF227 ROSIN FLUX 8 OZ .062 DIA.
Canfield Technologies
|
50 | 33.44000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
24-6337-0018
SOLDER RA FLUX 22AWG 63/37 1LB
Kester Solder
|
106 | 56.26000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-0001-0027
SOLDER FLUX-CORED/44 .031" 1LB S
Kester Solder
|
5,928 | 83.00680 | Active | Wire Solder | Sn95Sb5 (95/5) | 0.031" (0.79mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD2190
SOLDER SPHERES 63/37 .020 DIAM
Chip Quik Inc.
|
6,046 | 84.95000 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - | Details |
|
24-0015-0017
SOLDER FLUX-CORED/44 .025" 1LB S
Kester Solder
|
6,036 | 59.03450 | Active | Wire Solder | Pb97.5Ag1.5Sn1 (97.5/1.5/1) | 0.025" (0.64mm) | 588°F (309°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
NC3SWLF.020 0.3OZ
LF SOLDER WIRE MINI POCKET PACK
Chip Quik Inc.
|
48 | 5.77000 | Active | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 0.020" (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | - | Tube, 0.3 oz (8.51g) | - | - | - | Details |
|
24-6040-0061
SOLDER RA 60/40 14AWG 1LB
Kester Solder
|
179 | 57.56000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
25-7068-7610
SOLDER FLUX-CORED/275 .020" 4LB
Kester Solder
|
5,189 | 449.95500 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
TS391LT500C
THERMALLY STABLE SOLDER PASTE NO
Chip Quik Inc.
|
8,374 | 150.95000 | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | Details |
|
SMDLTLFP500T4C
SOLDER PASTE LOW TEMP T4 500G
Chip Quik Inc.
|
6,792 | 157.50000 | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
SMD2SWLT.040 200G
SN42/BI57.6/AG0.4 2.2% FLUX CORE
Chip Quik Inc.
|
5 | 195.35000 | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 7 oz (200g) | - | - | - | Details |
|
SMD3SW.015 100G
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Chip Quik Inc.
|
8 | 25.99000 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.015" (0.38mm) | 354°F (179°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Leaded | Spool, 3.53 oz (100g) | - | - | - | Details |
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