| Mfr Part # | Qty | Price | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
93-7069-9510
SN96.5AG3.0CU0.5 3.3%/268 .010
Kester Solder
|
234 | 75.30000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010" (0.25mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 30 AWG, 33 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
90-7068-6422
SOLDER FLUX-CORED/331 .015" 100G
Kester Solder
|
1,716 | 57.12560 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 3.53 oz (100g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMDSW.031 1LB
SOLDER WIRE 63/37 TIN/LEAD NO-CL
Chip Quik Inc.
|
1 | 40.67000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - | Details |
|
RASWLF.020 8OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Chip Quik Inc.
|
4 | 66.97000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - | Details |
|
SMD4300SNL500T3C
SOLDER PASTE SAC305 T3 500G
Chip Quik Inc.
|
8,341 | 108.75000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 3 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
24-7150-9710
SOLDER FLUX-CORED/285 .031" 1LB
Kester Solder
|
199 | 99.24000 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6337-9715
SOLDER FLUX-CORED/285 63/37 .050
Kester Solder
|
100 | 74.90000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.050" (1.27mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 16 AWG, 18 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMDSWLF.020 .4OZ
LF SOLDER WIRE POCKET PACK 96.5/
Chip Quik Inc.
|
3,458 | 11.49000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Tube, 0.4 oz (11.34g) | - | - | - | Details |
|
24-5050-0069
SOLDER FLUX-CORED/44 .125" 1LB S
Kester Solder
|
2,505 | 52.88360 | Active | Wire Solder | Sn50Pb50 (50/50) | 0.125" (3.18mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 8 AWG, 10 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD2024-25000
SOLDER SPHERES SN96.5/AG3.0/CU0.
Chip Quik Inc.
|
7 | 27.99000 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012" (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - | Details |
|
TS391LT10
THERMALLY STABLE SOLDER PASTE NO
Chip Quik Inc.
|
31 | 28.95000 | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | Details |
|
T0051388399
WSW SAC L0 SN3,0AG0,5CU3,5%
Apex Tool Group
|
7 | 38.00000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012" (0.31mm) | - | No-Clean | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - | Details |
|
92-9574-7650
SOLDER FLUX-CORED/275 .047" 500G
Kester Solder
|
9,938 | 71.91610 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.047" (1.19mm) | 441°F (227°C) | No-Clean | 17 AWG, 18 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD291SNLT4
SOLDER PASTE NO CLEAN LEAD-FREE
Chip Quik Inc.
|
14 | 18.99000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
70-4105-0910
SOLDER PASTE NO CLEAN 500GM
Kester Solder
|
8,006 | 153.52000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
SMD4300AX250T3
SOLDER PASTE SN63/PB37 250G
Chip Quik Inc.
|
21 | 42.95000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
NC191SNL35
SMOOTH FLOW LEAD-FREE SOLDER PAS
Chip Quik Inc.
|
1 | 18.95000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
92-7150-8807
SOLDER FLUX-CORED/245 .020 500G
Kester Solder
|
4,828 | 118.06900 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD4300AX10T5
SOLDER PASTE WATER SOL T5 10CC
Chip Quik Inc.
|
16 | 29.95000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 5 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
SMD4300AX500T3C
SOLDER PASTE 63/37 T3 500G
Chip Quik Inc.
|
8,673 | 83.25000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
NC3SWLF.031 1LB
LF SOLDER WIRE 96.5/3.5 TIN/SILV
Chip Quik Inc.
|
1 | 79.80000 | Active | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 0.031" (0.79mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - | Details |
|
NC2SW.020 1LB
SOLDER WIRE 60/40 TIN/LEAD NO-CL
Chip Quik Inc.
|
5 | 40.05000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - | Details |
|
24-6337-9713
SOLDER RMA FLUX 20AWG 63/37 1LB
Kester Solder
|
281 | 59.36000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6040-8815
SOLDER FLUX-CORED/245 .050" 1LB
Kester Solder
|
4,794 | 33.29970 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.050" (1.27mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 16 AWG, 18 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
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