| Mfr Part # | Qty | Price | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
24-6040-0026
SOLDER FLUX-CORED/44 .031" 1LB S
Kester Solder
|
449 | 54.33000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
NC191LTA500T5C
SMOOTH FLOW LOW TEMP SOLDER PAST
Chip Quik Inc.
|
1 | 135.90000 | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
14-7068-0062
SOLDER SOLID WIRE .062" 1LB SPL
Kester Solder
|
2,849 | 81.23430 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | - | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-7050-9702
SOLDER FLUX-CORED/285 .020" 1LB
Kester Solder
|
8,679 | 112.31400 | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.020" (0.51mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMDIN52SN48
INDIUM SOLDER WIRE (IN52/SN48) 0
Chip Quik Inc.
|
96 | 19.95000 | Active | Wire Solder | In52Sn48 (52/48) | 0.031" (0.79mm) | 244°F (118°C) | - | 20 AWG, 21 SWG | - | Lead Free | Spool | - | - | - | Details |
|
14-7068-0125
SOLDER SOLID WIRE .125" 1LB SPL
Kester Solder
|
5,744 | 81.29090 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.125" (3.18mm) | 423 ~ 424°F (217 ~ 218°C) | - | 8 AWG, 10 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD291AXT5
SOLDER PASTE NO CLEAN 63SN/37PB
Chip Quik Inc.
|
7,413 | 21.99000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
SMD2SWLF.031 2OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Chip Quik Inc.
|
13 | 16.31000 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - | - | Details |
|
92-6337-8860
SOLDER FLUX-CORED/245 63/37 .025
Kester Solder
|
9,585 | 43.79160 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | No-Clean | 22 AWG, 23 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
NC191SNL15T5
SMOOTH FLOW LEAD-FREE SOLDER PAS
Chip Quik Inc.
|
13 | 16.95000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
SMD4300AX10T4
SLDR PST WATR SOL 63/37 T4 10CC
Chip Quik Inc.
|
26 | 27.95000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
T0051386099
WSW SAC M1 SN3,0AG0,5CU3,5%
Apex Tool Group
|
3 | 118.00000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.063" (1.60mm) | - | No-Clean | - | - | Lead Free | Spool, 17.64 oz (500g) | - | - | - | Details |
|
TS391AX10
THERMALLY STABLE SOLDER PASTE NO
Chip Quik Inc.
|
6,200 | 26.95000 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | Details |
|
24-9574-1400
SOLDER 66 .062 14AWG 1LB
Kester Solder
|
477 | 87.54000 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.062" (1.57mm) | 441°F (227°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
RASW.031 .7OZ
SOLDER WIRE POCKET PACK 63/37 TI
Chip Quik Inc.
|
106 | 4.45000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Tube, 0.7 oz (19.85g) | - | - | - | Details |
|
SMDBI100-S-1
SOLDER SHOT BI100 1OZ 28G
Chip Quik Inc.
|
22 | 9.00000 | Active | Solder Shot | Bi100(100) | - | 521°F (271°C) | - | - | - | Lead Free | Bag, 1 oz (28g) | - | - | - | Details |
|
96-6337-9531
SN63PB37 3.3%/268 .031 500 G
Kester Solder
|
164 | 68.03000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 AWG | - | Leaded | Spool, 17.64 oz (500g) | - | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
WC6301062
63SN/37PB WATER SOLUBLE FLUX 1 L
Canfield Technologies
|
50 | 41.53000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
24-6337-8809
SOLDER NO-CLEAN 22AWG 63/37 1LB
Kester Solder
|
131 | 62.74000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | No-Clean | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMD4300SNL500T5C
SOLDER PASTE SAC305 T5 500G
Chip Quik Inc.
|
2,528 | 214.28000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 5 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
SMD2028-25000
SOLDER SPHERES SN96.5/AG3.0/CU0.
Chip Quik Inc.
|
4 | 26.99000 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.014" (0.36mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - | Details |
|
NC4SW.031 0.5OZ
SOLDER WIRE MINI POCKET PACK 93.
Chip Quik Inc.
|
19 | 3.13000 | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.031" (0.79mm) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Tube, 0.50 oz (14.17g) | - | - | - | Details |
|
SMD291SNL500T5C
SOLDER PASTE SAC305 T5 500G
Chip Quik Inc.
|
6,367 | 214.28000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
70-0102-0411
SOLDER PASTE NO CLEAN 600GM
Kester Solder
|
9,305 | 186.64800 | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | No-Clean | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
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