| Mfr Part # | Qty | Price | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
24-7068-6409
SOLDER WATER SOL .050" 16AWG 1LB
Kester Solder
|
253 | 130.07000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.050" (1.27mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 16 AWG, 18 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
WCBLF227L2031
BLF 227 WATER SOLUBLE FLUX 8 OZ
Canfield Technologies
|
50 | 35.19000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
RCBLF22701062P
BLF 227 ROSIN FLUX 1 LB. 062 DIA
Canfield Technologies
|
50 | 56.00000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
24-7050-0027
SOLDER RA 9SN6.3/AG3.7 20AWG 1LB
Kester Solder
|
2,278 | 90.46770 | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.031" (0.79mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - | Details |
|
14-6040-0062
SOLDER SOLID WIRE 14AWG 60/40
Kester Solder
|
4,240 | 33.61790 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | - | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
18-7000-0078
SOLDER SOLID WIRE .078" 20LB SPL
Kester Solder
|
3,218 | 998.28400 | Active | Wire Solder | Sn99 (99) | 0.078" (1.98mm) | - | - | 12 AWG, 14 SWG | - | Lead Free | Spool, 20 lbs (9.07kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
RASWLF.031 8OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Chip Quik Inc.
|
8 | 56.91000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - | Details |
|
26-6040-7614
SOLDER FLUX-CORED/275 .062" 5LB
Kester Solder
|
5,469 | 235.28950 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 14 AWG, 16 SWG | - | Leaded | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
70-0605-0911
SOLDER PASTE NO CLEAN 600GM
Kester Solder
|
4,299 | 203.61600 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 4 | Lead Free | Cartridge, 21.16 oz (600g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
RC6001062P
60SN/40PB ROSIN FLUX 1 LB .062 D
Canfield Technologies
|
50 | 40.02000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
24-7068-1400
SOLDER RA .062" 14AWG 1LB
Kester Solder
|
70 | 131.75000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
SMDSWLF.020 2OZ
SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Chip Quik Inc.
|
10 | 18.18000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - | - | Details |
|
24-7050-9727
SOLDER FLUX-CORED/285 .015" 1LB
Kester Solder
|
8,732 | 115.04310 | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.015" (0.38mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-7340-9713
SOLDER FLUX-CORED/285 .031" 1LB
Kester Solder
|
5,343 | 86.12680 | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.031" (0.79mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
70-1002-0511
SOLDER PASTE WATER SOLUBLE 600GM
Kester Solder
|
7,441 | 135.74400 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Details |
|
WC6301031
63SN/37PB WATER SOLUBLE FLUX 1 L
Canfield Technologies
|
50 | 43.89000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
SMD3SWLT.047 4OZ
SOLDER WIRE SN42/BI58 .047" 4OZ
Chip Quik Inc.
|
10 | 42.54000 | Active | Wire Solder | Bi58Sn42 (58/42) | 0.047" (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - | Details |
|
SMD291SNL250T4
SLDR PST NO-CLEAN SAC305 T4 250G
Chip Quik Inc.
|
1,804 | 65.95000 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Details |
|
SMD2020-25000
SOLDER SPHERES SN96.5/AG3.0/CU0.
Chip Quik Inc.
|
20 | 28.99000 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010" (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - | Details |
|
24-6040-0027
SOLDER RA 60/40 20AWG 1LB
Kester Solder
|
418 | 60.11000 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
24-6337-9700
SOLDER RMA FLUX 24AWG 63/37 1LB
Kester Solder
|
136 | 62.54000 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | Details |
|
BARSN96.5AG3.0CU0.5-8OZ
SOLDER BAR SN96.5/AG3.0/CU0.5 8O
Chip Quik Inc.
|
2 | 39.09000 | Active | Bar Solder | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Bar, 0.5 lb (227g) | - | - | - | Details |
|
CCBLF227L2020
BLF 227 NO CLEAN FLUX 8 OZ .020
Canfield Technologies
|
50 | 40.84000 | Active | - | - | - | - | - | - | - | - | - | - | - | - | Details |
|
RASWLF.020 4OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Chip Quik Inc.
|
2,896 | 21.31000 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - | Details |
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