| Mfr Part # | Qty | Price | Product Status | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0630-02IV
IC MODULE LX150 100MHZ 128MB
Trenz Electronic GmbH
|
5,170 | 420.20000 | Active | FPGA, USB Core | Spartan-6 LX-150 | Cypress EZ-USB FX2LP | 100MHz | 8MB | 128MB | B2B | 1.6" x 1.9" (40.5mm x 47.5mm) | -40°C ~ 85°C | Details |
|
TE0745-02-91C31-A
MOD SOM DDR3L 1GB
Trenz Electronic GmbH
|
8,788 | 1290.38000 | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.05" x 2.99" (52mm x 76mm) | -40°C ~ 85°C | Details |
|
TE0720-04-31C33MA
IC SOC MODULE XILINX ZYNQ
Trenz Electronic GmbH
|
1,143 | 288.20000 | Active | Ethernet Core | ARM® Cortex®-A9 | - | 766MHz | 32MB | 1GB | Board-to-Board (BTB) Socket | 1.97" x 1.57" (50mm x 40mm) | 0°C ~ 70°C | Details |
|
TE0808-04-6BE21-AK
IC MOD SOM MPSOC 4GB ZU6EG
Trenz Electronic GmbH
|
4,289 | 1334.25000 | Active | MPU Core | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | - | 128MB | 4GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C | Details |
|
5962-9162304MXC
SMJ34020A GRAPHICS SYSTEM PROCES
Texas Instruments
|
1 | 2039.56000 | Active | - | - | - | - | - | - | - | - | - | Details |
|
TE0723-03-11C64-A
IC MOD CORTEX-A9 766MHZ 512MB
Trenz Electronic GmbH
|
8,261 | 152.90000 | Active | - | - | - | - | - | - | - | - | - | Details |
|
OSD3358-512M-ICC
SIP;3358;512M;ICC
Octavo Systems LLC
|
8,332 | 47.58230 | Active | MPU Core | ARM® Cortex®-A8, AM3358 | - | 1GHz | 4KB EEPROM, 16GB eMMC | 512MB | 400-BGA | 1.06" x 1.06" (27.0mm x 27.0mm) | -40°C ~ 85°C | Details |
|
100-1221-3
IC MOD CM-BF537 600MHZ 32MB
BECOM Systems GmbH
|
23 | 364.50000 | Active | MPU Core | CM-BF537 | - | 600MHz | 4MB | 32MB | Expansion 2 x 60 | 1.44" x 1.24" (36.5mm x 31.5mm) | 0°C ~ 70°C | Details |
|
TE0803-01-04CG-1EA
IC MODULE ZYNQ USCALE 2GB 128MB
Trenz Electronic GmbH
|
8,255 | 675.00000 | Active | MPU Core | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.99" x 2.05" (76mm x 52mm) | 0°C ~ 85°C | Details |
|
TE0720-04-62I33ML
IC SOC MODULE XILINX ZYNQ
Trenz Electronic GmbH
|
3,873 | 331.10000 | Active | Ethernet Core | ARM® Cortex®-A9 | - | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C | Details |
|
TE0630-02IBF
IC MOD SPARTAN-6 100MHZ 128MB
Trenz Electronic GmbH
|
1,443 | 293.70000 | Active | FPGA, USB Core | Spartan-6 LX-75 | Cypress EZ-USB FX2LP | 100MHz | 8MB | 128MB | B2B | 1.6" x 1.9" (40.5mm x 47.5mm) | -40°C ~ 85°C | Details |
|
20-101-0079
IC MOD Z180 9.216MHZ 32KB
Digi
|
9,317 | 86.90060 | Obsolete | MPU Core | Z180 | - | 9.216MHz | 512KB EPROM | 32KB | 40 Pin Header | 1.8" x 2.05" (46mm x 52mm) | -40°C ~ 70°C | Details |
|
TE0808-04-BBE21-A
IC MODULE ZYNQ USCALE 2GB 128MB
Trenz Electronic GmbH
|
4,446 | 1967.62000 | Active | MPU Core | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | - | 128MB | 4GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C | Details |
|
TE0745-02-81C31-A
MOD SOM DDR3L 1GB
Trenz Electronic GmbH
|
4,896 | 1092.38000 | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7035) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 160 | 2.05" x 2.99" (52mm x 76mm) | -40°C ~ 85°C | Details |
|
DC-VA-H264-10B-60-1080-MD00C-A200T
MOD H264 DEC 60FPS 1080 SODIMM
System-On-Chip (SOC) Technologies Inc.
|
8,610 | 814.50000 | Active | DSP, FPGA Core | - | Xilinx Artix-7 XC7A200T | - | 32MB | 512MB | SO-DIMM | - | - | Details |
|
TE0741-04-G2I-1-A
MODULE FPGA KINTEX
Trenz Electronic GmbH
|
5,708 | 1637.90000 | Active | FPGA Core | Xilinx Kintex-7 FPGA XC7K410T-2FBG676I | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C | Details |
|
2EC-VA-H264-10B-30-4K-MD00C-SX660
MOD H264 EN 30FPS 4K SX660 SODIM
System-On-Chip (SOC) Technologies Inc.
|
2,653 | 2293.50000 | Active | FPGA Core | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 1.5GHz | 128KB | 512MB | - | - | - | Details |
|
TE0807-03-4AI21-A
MPSOC ZYNQ USCALE 4GB DDR4
Trenz Electronic GmbH
|
6,683 | 1345.50000 | Active | MPU Core | Zynq UltraScale+ XCZU4CG-1FBVB900I | - | - | 128MB | 4GB | B2B | 2.05" x 2.99" (52mm x 76mm) | -40°C ~ 85°C | Details |
|
TE0782-02-82I33MA
IC MODULE CORTEX
Trenz Electronic GmbH
|
1,096 | 2016.00000 | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7035) | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 3.35" x 3.35" (85mm x 85mm) | -40°C ~ 85°C | Details |
|
TE0745-02-71I31-A
MOD SOM DDR3L 1GB
Trenz Electronic GmbH
|
7,526 | 599.62000 | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7030) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 160 | 2.05" x 2.99" (52mm x 76mm) | -40°C ~ 85°C | Details |
|
TE0823-01-3PIU1MA
ICOBOARD
Trenz Electronic GmbH
|
1,076 | 698.00000 | Active | MCU, FPGA | ARM Cortex-A53, ARM® Cortex®-R5 | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | - | 128MB | 1GB | USB | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C | Details |
|
EDM1-IMX6S-MSD
IC MODULE CORTEX-A9 512MB 10PK
Wandboard.Org
|
3,266 | 85.70100 | Active | MPU Core | ARM® Cortex®-A9, i.MX6Solo | - | - | - | 512MB | EDM Connector | 2.36" x 3.23" (60mm x 82mm) | - | Details |
|
EC-VA-H264-10B-60-1080-OPVXC-0000
ENCODER H264 HD VID/AUD 10BIT
System-On-Chip (SOC) Technologies Inc.
|
8,185 | 2548.50000 | Active | - | - | - | - | - | - | - | - | - | Details |
|
DG8065101533700
INTEL ATOM PROCESSOR Z2520
Intel
|
11,507 | 14.47000 | Active | - | - | - | - | - | - | - | - | - | Details |
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