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TE0720-04-62I33ML - Trenz Electronic GmbH - Embedded - Microcontroller, Microprocessor, FPGA Modules

TE0720-04-62I33ML

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

TE0720-04-62I33ML is a Embedded - Microcontroller, Microprocessor, FPGA Modules manufactured by Trenz Electronic GmbH. IC SOC MODULE XILINX ZYNQ. Key specifications: operating temperature -40°C ~ 85°C, size / dimension 1.97" x 1.57" (50mm x 40mm), connector type Board-to-Board (BTB) Socket.

In Stock: 3,873

Product Attributes

AttributeValue
Product StatusActive
Module/Board TypeEthernet Core
Core ProcessorARM® Cortex®-A9
Co-Processor-
Speed-
Flash Size32MB
RAM Size1GB
Connector TypeBoard-to-Board (BTB) Socket
Size / Dimension1.97" x 1.57" (50mm x 40mm)
Operating Temperature-40°C ~ 85°C

Frequently Asked Questions

TE0720-04-62I33ML is a Embedded - Microcontroller, Microprocessor, FPGA Modules manufactured by Trenz Electronic GmbH. IC SOC MODULE XILINX ZYNQ

The operating temperature range of TE0720-04-62I33ML is -40°C ~ 85°C.

The size of TE0720-04-62I33ML is 1.97" x 1.57" (50mm x 40mm).

The connector type of TE0720-04-62I33ML is Board-to-Board (BTB) Socket.

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