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W66CM2NQUAFJ - Winbond Electronics - Memory

W66CM2NQUAFJ

Winbond Electronics

4GB LPDDR4X, DDP, X32, 1600MHZ,

W66CM2NQUAFJ is a Memory manufactured by Winbond Electronics. 4GB LPDDR4X, DDP, X32, 1600MHZ,. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 105°C (TC), voltage - supply 1.06V ~ 1.17V, 1.7V ~ 1.95V, package / case 200-WFBGA.

In Stock: 3,383

Product Attributes

AttributeValue
Product StatusNot For New Designs
Memory TypeVolatile
Memory FormatDRAM
TechnologySDRAM - Mobile LPDDR4X
Memory Size4Gb (128M x 32)
Memory InterfaceLVSTL_11
Clock Frequency1.6 GHz
Write Cycle Time - Word, Page18ns
Access Time3.5 ns
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature-40°C ~ 105°C (TC)
Mounting TypeSurface Mount
Package / Case200-WFBGA
Supplier Device Package200-WFBGA (10x14.5)

Frequently Asked Questions

W66CM2NQUAFJ is a Memory manufactured by Winbond Electronics. 4GB LPDDR4X, DDP, X32, 1600MHZ,

The mounting type of W66CM2NQUAFJ is Surface Mount.

The operating temperature range of W66CM2NQUAFJ is -40°C ~ 105°C (TC).

The supply voltage of W66CM2NQUAFJ is 1.06V ~ 1.17V, 1.7V ~ 1.95V.

The memory specification of W66CM2NQUAFJ is 4Gb (128M x 32).

Alternative Products

W66CM2NQUAFJ is Not For New Designs. Consider these compatible alternatives:

Part NumberManufacturerDescriptionMatch
IS46LQ32640A-062TBLA2-TR ISSI, Integrated Silicon Solution Inc IC DRAM 2GBIT LVSTL 200TFBGA 100% View
IS46LQ32640AL-062BLA2-TR ISSI, Integrated Silicon Solution Inc IC DRAM 2GBIT LVSTL 200VFBGA 100% View
W66BP6NBUAGJ Winbond Electronics 2GB LPDDR4, X16, 1866MHZ, -40C~1 94% View
IS46LQ32512A-053BLA2 ISSI, Integrated Silicon Solution Inc 16G, 1.06-1.17/1.70-1.95V, LPDDR 94% View
W66BL6NBUAHJ Winbond Electronics 2GB LPDDR4, X16, 2133MHZ, -40C~1 88% View
IS46LQ32512A-046BLA2 ISSI, Integrated Silicon Solution Inc 16G, 1.06-1.17/1.70-1.95V, LPDDR 88% View

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