3J LIMITED
PA0170-S
MINI SOIC-8 EXP PAD STENCIL
PA0170-S is a Solder Stencils, Templates manufactured by Chip Quik Inc.. MINI SOIC-8 EXP PAD STENCIL. Key specifications: material Stainless Steel, number of positions 8, pitch 0.026" (0.65mm).
In Stock: 2,853
Product Attributes
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Mini SOIC |
| Number of Positions | 8 |
| Pitch | 0.026" (0.65mm) |
| Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Inner Dimension | 0.118" L x 0.118" W (3.00mm x 3.00mm) |
| Thermal Center Pad | 0.315" L x 0.067" W (8.00mm x 1.70mm) |
| Material | Stainless Steel |
Frequently Asked Questions
PA0170-S is a Solder Stencils, Templates manufactured by Chip Quik Inc.. MINI SOIC-8 EXP PAD STENCIL
The material of PA0170-S is Stainless Steel.
The number of positions of PA0170-S is 8.
The pitch of PA0170-S is 0.026" (0.65mm).
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