BGA-676 (1.0 MM PITCH, 26 X 26 G
BGA0034-S is a Solder Stencils, Templates manufactured by Chip Quik Inc.. BGA-676 (1.0 MM PITCH, 26 X 26 G. Key specifications: material Stainless Steel, number of positions 676, pitch 0.039" (1.00mm).
In Stock: 8
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | BGA |
| Number of Positions | 676 |
| Pitch | 0.039" (1.00mm) |
| Outer Dimension | 2.600" L x 1.800" W (66.04mm x 45.72mm) |
| Inner Dimension | 1.024" L x 1.024" W (26.00mm x 26.00mm) |
| Thermal Center Pad | - |
| Material | Stainless Steel |
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3J LIMITED
