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Sockets for ICs, Transistors

26,642 products
Mfr Part # Qty Price Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
346-93-164-41-012000
CONN SOCKET SIP 64POS GOLD
Mill-Max Manufacturing Corp.
5,747 18.35880 Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
299-87-312-10-001101
CONN IC DIP SOCKET 12POS GOLD
Preci-Dip
5,240 2.01720 Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
110-83-306-41-605101
CONN IC DIP SOCKET 6POS GOLD
Preci-Dip
3,230 0.32180 Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
116-87-424-41-007101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
2,700 1.98310 Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
ED241DT
CONN IC DIP SOCKET 24POS TIN
On Shore Technology Inc.
10,927 0.35000 Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C Details
8428-11B1-RK-TP
CONN SOCKET PLCC 28POS TIN
3M
2,227 1.71000 Active PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C Details
116-87-320-41-012101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
3,981 1.92280 Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
712-43-112-41-001000
SOCKET CARRIER SIP 12POS
Mill-Max Manufacturing Corp.
1,760 13.90430 Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
NTE436W16
16-PIN DIP IC SOCKET
NTE Electronics, Inc
1,846 2.29000 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) - - - - Through Hole - Wire Wrap - - - - - - Details
917-83-210-41-005101
CONN TRANSIST TO-5 10POS GOLD
Preci-Dip
1,788 1.45180 Active Transistor, TO-5 10 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
5-1571552-0
CONN IC DIP SOCKET 32POS GOLD
TE Connectivity AMP Connectors
6,634 3.33000 Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C Details
818-AG11D
CONN IC DIP SOCKET 18POS GOLD
TE Connectivity AMP Connectors
432 5.25000 Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C Details
110-99-318-41-001000
CONN IC DIP SOCKET 18POS TINLEAD
Mill-Max Manufacturing Corp.
868 1.15000 Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
123-83-636-41-001101
CONN IC DIP SOCKET 36POS GOLD
Preci-Dip
3,973 4.12340 Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
346-43-164-41-013000
CONN SOCKET SIP 64POS GOLD
Mill-Max Manufacturing Corp.
143 9.86000 Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
116-83-420-41-001101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
1,538 2.44740 Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
612-87-628-41-001101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
8,988 1.55860 Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
122-87-306-41-001101
CONN IC DIP SOCKET 6POS GOLD
Preci-Dip
2,955 0.44240 Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C Details
110-13-422-41-001000
CONN IC DIP SOCKET 22POS GOLD
Mill-Max Manufacturing Corp.
8,661 14.02800 Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
XR2A-2411-N
CONN IC DIP SOCKET 24POS GOLD
Omron Electronics Inc-EMC Div
11 4.45000 Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C Details
346-93-107-41-013000
CONN SOCKET SIP 7POS GOLD
Mill-Max Manufacturing Corp.
4,050 1.50000 Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
123-13-314-41-001000
CONN IC DIP SOCKET 14POS GOLD
Mill-Max Manufacturing Corp.
51 5.34000 Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C Details
SA246040
CONN IC DIP SOCKET 24POS GOLD
On Shore Technology Inc.
113 1.28000 Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C Details
ICO-316-SGT
CONN IC DIP SOCKET 16POS GOLD
Samtec Inc.
100 4.12000 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C Details

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