Sockets for ICs, Transistors

Mfr Part #	Qty	Price	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
1-1571995-0 CONN SOCKET SIP 10POS TIN TE Connectivity AMP Connectors	924	1.59000	Obsolete	SIP	10 (2 x 5)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	20.0µin (0.51µm)	Copper	Thermoplastic, Polyester	-	Details
115-43-318-41-001000 CONN IC DIP SOCKET 18POS GOLD Mill-Max Manufacturing Corp.	128	2.51000	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
110-47-964-41-001000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	129	4.73000	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
116-83-420-41-008101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	5,644	2.29880	Active	DIP, 0.4" (10.16mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
116-87-628-41-002101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	8,199	2.74280	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
8428-21B1-RK-TR CONN SOCKET PLCC 28POS TIN 3M	3,522	2.08000	Active	PLCC	28 (4 x 7)	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Copper Alloy	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C	Details
110-87-320-41-105101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	6,067	1.04120	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
ICF-632-S-O-TR CONN IC DIP SOCKET 32POS TIN Samtec Inc.	273	9.97000	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)	-55°C ~ 125°C	Details
117-83-664-41-005101 CONN IC DIP SOCKET 64POS GOLD Preci-Dip	2,516	4.42360	Active	DIP, 0.6" (15.24mm) Row Spacing	64 (2 x 32)	0.070" (1.78mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
116-87-308-41-003101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	8,850	0.50350	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
PLCC-84-AT-SMT PLCC SOCKET 84P SMT Adam Tech	490	2.01000	Active	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C	Details
123-13-624-41-001000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	8,078	6.52850	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
714-43-117-31-018000 CONN SOCKET SIP 17POS GOLD Mill-Max Manufacturing Corp.	8,444	4.99000	Active	SIP	17 (1 x 17)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C	Details
299-87-306-10-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	9,306	0.97370	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
110-83-322-41-005101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	7,569	1.26720	Active	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
116-83-422-41-004101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	6,495	3.89310	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
116-83-328-41-003101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	7,029	2.38150	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
2201838-1 CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors	275	25.21000	Last Time Buy	LGA	2011 (47 x 58)	0.040" (1.02mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.035" (0.90mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic	-	Details
540-88-044-17-400-TR CONN SOCKET PLCC 44POS TIN Preci-Dip	5,042	0.96120	Active	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-	Details
116-87-636-41-004101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	7,100	6.47680	Active	DIP, 0.6" (15.24mm) Row Spacing	36 (2 x 18)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
116-87-316-41-008101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	9,673	1.38410	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details
ICM-624-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 24P Adam Tech	425	1.17000	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C	Details
200-6319-9UN-1900 CONN SOCKET PGA ZIF 361POS GOLD 3M	39	99.54000	Obsolete	PGA, ZIF (ZIP)	361 (19 x 19)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES)	-55°C ~ 150°C	Details
116-87-322-41-008101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	7,723	1.83950	Active	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C	Details

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