| Mfr Part # | Qty | Price | Product Status | Type | Shape | Width | Length | Height | Material | Plating | Plating - Thickness | Attachment Method | Operating Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4787PA51H01800
GSKT FAB/FOAM 6.4X457.2MM DSHAPE
Laird Technologies EMI
|
4,807 | 6.32000 | Active | Fabric Over Foam | D-Shape | 0.252" (6.40mm) | 18.000" (457.20mm) | 0.201" (5.10mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - | Details |
|
S7161-45R
RFI SHIELD FINGER AU 3.5MM SMD
Harwin Inc.
|
1,017 | 0.44000 | Active | Shield Finger | - | 0.091" (2.30mm) | 0.181" (4.60mm) | 0.138" (3.50mm) | Phosphor Bronze | Gold | Flash | Solder | -20°C ~ 70°C | Details |
|
2040852-1
SHIELD FINGER 0820 N-B WITH SE
TE Connectivity AMP Connectors
|
75,721 | 0.43000 | Active | Shield Finger | - | 0.079" (2.00mm) | 0.134" (3.40mm) | 0.031" (0.80mm) | Copper Alloy | Gold | Flash | Solder | - | Details |
|
331151722590
WE-SECF SMT EMI CONTACT FINGER
Würth Elektronik
|
1,000 | 0.78800 | Active | - | - | - | - | - | - | - | - | Solder | - | Details |
|
67B8G2507006215R00
SP,CON,8,AU,TNR
Laird Technologies EMI
|
4,918 | 0.71180 | Active | Fingerstock | - | 0.098" (2.50mm) | 0.276" (7.00mm) | 0.244" (6.20mm) | Beryllium Copper | Gold | - | Solder | - | Details |
|
WS-4420-01-A
CONDUCTIVE FOAM EMI GASKET
3G Shielding Specialties LP
|
6 | 105.00000 | Active | Shielding Material | Square | 9.843" (250.00mm) | 9.843" (250.00mm) | 0.079" (2.00mm) | Polyurethane Foam | Copper, Nickel | - | Adhesive | -40°C ~ 93°C | Details |
|
37-131-1041-02400
HITEMP FAB/FM .387X.394X24" RECT
Parker Chomerics
|
79 | 24.65000 | Active | Fabric Over Foam | Rectangle | 0.394" (10.01mm) | 24.000" (609.60mm) | 0.387" (9.83mm) | Nickel-Copper Polyester (NI/CU) | Nickel | - | Adhesive | -40°C ~ 125°C | Details |
|
BMI-C-007-01
CONTACT BECU 3.3X1.0MM
Laird Technologies EMI
|
22,766 | 0.78000 | Active | Fingerstock | - | 0.059" (1.50mm) | 0.130" (3.30mm) | 0.126" (3.20mm) | Beryllium Copper | Tin | - | Solder | - | Details |
|
81-01-32AS1-2000
FINGERSTOCK 0.22X0.6X18"
Parker Chomerics
|
5,951 | 24.45000 | Active | Fingerstock | - | 0.600" (15.24mm) | 17.992" (457.00mm) | 0.220" (5.59mm) | Beryllium Copper | Unplated | - | Non-Conductive Adhesive | -40°C ~ 121°C | Details |
|
0C97055902
RFI EMI GROUNDING MATERIAL 25FT
Laird Technologies EMI
|
6,585 | 192.71200 | Active | Fingerstock | - | 0.300" (7.62mm) | 24.000" (609.60mm) | 0.070" (1.78mm) | Beryllium Copper | Unplated | - | Adhesive | 121°C | Details |
|
0097091502
FINGERSTOCK BECU 11.43X381MM
Laird Technologies EMI
|
9,632 | 13.60400 | Active | Fingerstock | - | 0.450" (11.43mm) | 15.000" (381.00mm) | 0.140" (3.56mm) | Beryllium Copper | - | - | Adhesive | 121°C | Details |
|
5401-0006-40-300
M83528/001D006, AG/AL FILLED FLO
Leader Tech Inc.
|
1 | 203.77000 | Active | Shielding Material | Round | 0.093" (2.36mm) | 25.000' (7.62m) | 0.093" (2.36mm) | Conductive Elastomer | - | - | Adhesive | -55°C ~ 160°C | Details |
|
4286PA51H01800
GASKET FAB/FOAM 10X457.2MM RECT
Laird Technologies EMI
|
362 | 7.65000 | Active | Fabric Over Foam | Rectangle | 0.394" (10.00mm) | 18.000" (457.20mm) | 0.118" (3.00mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - | Details |
|
0077005617
FINGERSTOCK BECU 8.1X406.4MM
Laird Technologies EMI
|
9,253 | 8.91450 | Active | Fingerstock | - | 0.320" (8.13mm) | 15.984" (406.00mm) | 0.110" (2.79mm) | Beryllium Copper | Tin | 299.99µin (7.62µm) | Slot | 121°C | Details |
|
0077008302
GASKET BECU 9.4X406.4MM
Laird Technologies EMI
|
7,327 | 10.32440 | Active | Fingerstock | - | 0.370" (9.40mm) | 16.000" (406.40mm) | 0.130" (3.30mm) | Beryllium Copper | - | - | Adhesive | 121°C | Details |
|
38401504
WE-EGS EMI ELASTOMER GASKET
Würth Elektronik
|
5 | 69.29000 | Active | Gasket | - | 0.156" (3.96mm) | 39.370" (1.00m) | 0.155" (3.94mm) | Conductive Elastomer | Nickel | - | - | -55°C ~ 160°C | Details |
|
4080PA51H01200
GK NICU PTAFG PU V0 REC
Laird Technologies EMI
|
5,898 | 11.71780 | Active | Fabric Over Foam | Rectangle | 1.000" (25.40mm) | 12.000" (304.80mm) | 0.059" (1.50mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - | Details |
|
4600PAH1K01800
GSKT FAB/FOAM 11.4X457.2MM CFOLD
Laird Technologies EMI
|
4,500 | 16.29000 | Active | Fabric Over Foam | C-Fold | 0.449" (11.40mm) | 18.000" (457.20mm) | 0.413" (10.50mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - | Details |
|
S0951-46R
RFI SHIELD CLIP MINI TIN SMD
Harwin Inc.
|
179,623 | 0.36000 | Active | Shield Clip | - | 0.043" (1.10mm) | 0.154" (3.90mm) | 0.050" (1.28mm) | Stainless Steel | Tin | 118.11µin (3.00µm) | Solder | -40°C ~ 85°C | Details |
|
4741PA51H01800
GASKET FAB/FOAM 6.5X457.2MM RECT
Laird Technologies EMI
|
1,104 | 6.32000 | Active | Fabric Over Foam | Rectangle | 0.256" (6.50mm) | 18.000" (457.20mm) | 0.157" (4.00mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - | Details |
|
38401301
WE-EGS EMI ELASTOMER GASKET
Würth Elektronik
|
10 | 34.65000 | Active | Gasket | Round | 0.047" (1.20mm) | 39.370" (1.00m) | - | Conductive Elastomer | Nickel | - | - | -55°C ~ 160°C | Details |
|
4047PA51H01800
GASKET FAB/FOAM 12.7X457.2MM REC
Laird Technologies EMI
|
5,831 | 7.09860 | Active | Fabric Over Foam | Rectangle | 0.500" (12.70mm) | 18.000" (457.20mm) | 0.150" (3.80mm) | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) | - | - | Adhesive | - | Details |
|
82-13281
SI MONEL STRIP .062" X .5" PSA
Parker Chomerics
|
5,080 | 9.00000 | Active | Shielding Material | Sheet | 0.500" (12.70mm) | 11.000' (3.35m) | 0.062" (1.57mm) | Conductive Elastomer | - | - | - | -54°C ~ 200°C | Details |
|
0097091802
FINGERSTOCK BECU 8.9X381MM
Laird Technologies EMI
|
7,070 | 14.86400 | Active | Fingerstock | - | 0.350" (8.89mm) | 15.000" (381.00mm) | 0.110" (2.79mm) | Beryllium Copper | - | - | Adhesive | 121°C | Details |
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