| Mfr Part # | Qty | Price | Product Status | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0745-02-93E31-A
MOD SOM DDR3L 1GB
Trenz Electronic GmbH
|
7,233 | 2445.75000 | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.05" x 2.99" (52mm x 76mm) | -40°C ~ 85°C | Details |
|
TE0720-04-62I33NA
IC SOC MODULE XILINX ZYNQ
Trenz Electronic GmbH
|
8,655 | 356.40000 | Active | Ethernet Core | ARM® Cortex®-A9 | - | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C | Details |
|
TE0803-04-4DE11-A
IC MODULE ZYNQ USCALE 2GB 128MB
Trenz Electronic GmbH
|
3,188 | 654.75000 | Active | MPU Core | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C | Details |
|
TE0741-04-D2I-1-A
MODULE FPGA KINTEX
Trenz Electronic GmbH
|
9,770 | 1086.80000 | Active | FPGA Core | Xilinx Kintex-7 FPGA XC7K325T-2FBG676I | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C | Details |
|
TE0803-04-2BE11-A
IC MODULE ZYNQ USCALE 2GB 128MB
Trenz Electronic GmbH
|
2,488 | 436.50000 | Active | MPU Core | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C | Details |
|
SOMOMAP3530-12-1783JFIR
IC MOD OMAP3530 600MHZ 256MB
Beacon EmbeddedWorks
|
99 | 706.63000 | Active | MPU, DSP Core | OMAP3530 | TMS320C64x (DSP) | 600MHz | 512MB (NAND), 16MB (NOR) | 256MB | - | 3.01" x 1.23" (76.5mm x 31.2mm) | -40°C ~ 85°C | Details |
|
TE0803-04-3BE11-A
IC MODULE ZYNQ USCALE 2GB 128MB
Trenz Electronic GmbH
|
2,413 | 532.12000 | Active | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C | Details |
|
TE0712-02-82C36-L
FPGA MODULE ARTIX7
Trenz Electronic GmbH
|
5,683 | 394.88000 | Active | FPGA Core | Artix-7 A200T | - | 200MHz | 32MB | 1GB | Samtec LSHM | 1.97" x 1.57" (50mm x 40mm) | 0°C ~ 85°C | Details |
|
TE0823-01-3PIU1ML
ICOBOARD
Trenz Electronic GmbH
|
1,225 | 698.00000 | Active | MCU, FPGA | ARM Cortex-A53, ARM® Cortex®-R5 | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | - | 128MB | 1GB | USB | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C | Details |
|
OSD32MP157F-512M-BAA
SIP: 157F, 512MB, BAA
Octavo Systems LLC
|
3,647 | 56.32040 | Active | MPU Core | Arm® Dual Cortex®-A7, Arm® Cortex®-M4 | NEON™ SIMD | 800MHz | - | 512MB | 302-BGA | 0.71" x 0.71" (18mm x 18mm) | 0°C ~ 85°C | Details |
|
TE0741-04-D2C-1-A
MODULE FPGA KINTEX
Trenz Electronic GmbH
|
9,350 | 959.20000 | Active | FPGA Core | Xilinx Kintex-7 FPGA XC7K325T-2FBG676C | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.97" x 1.57" (50mm x 40mm) | 0°C ~ 70°C | Details |
|
L138-FX-325-RC
MITYDSP-L138F SOM W/ OMAP-L138
Critical Link LLC
|
6,752 | 253.72000 | Active | MPU, DSP, FPGA Core | ARM926EJ-S, OMAP-L138 | TMS320C674x (DSP) | 456MHz | 256MB (NAND), 16MB (NOR) | 128MB | SO-DIMM-200 | 2.66" x 2" (67.6mm x 50.8mm) | 0°C ~ 70°C | Details |
|
EC-VA-H264-10B-60-1080-MD00C-A200T
MOD H264 ENC 60FPS 1080 SODIMM
System-On-Chip (SOC) Technologies Inc.
|
8,877 | 814.50000 | Active | DSP, FPGA Core | - | Xilinx Artix-7 XC7A200T | - | 32MB | 512MB | SO-DIMM | - | - | Details |
|
TE0782-02-A2I33MA
IC MODULE CORTEX
Trenz Electronic GmbH
|
7,539 | 2719.12000 | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7100) | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 3.35" x 3.35" (85mm x 85mm) | -40°C ~ 85°C | Details |
|
100-1254-2
IC MOD CM-BF527 600MHZ 64MB
BECOM Systems GmbH
|
1 | 301.05000 | Active | MPU Core | CM-BF527 | - | 600MHz | 8MB | 64MB | Expansion 2 x 60 | 1.22" x 1.42" (31mm x 36mm) | 0°C ~ 70°C | Details |
|
DG8065101274708
INTEL ATOM PROCESSOR Z2560
Intel
|
6,360 | 18.61000 | Active | - | - | - | - | - | - | - | - | - | Details |
|
2EC-VA-MPEG2-8B-30-1080-MD00C-A200T
MOD MPEG2 ENC 30FPS 1080 SODIMM
System-On-Chip (SOC) Technologies Inc.
|
2,180 | 1044.00000 | Active | DSP, FPGA Core | - | Xilinx Artix-7 XC7A200T | - | 32MB | 512MB | SO-DIMM | - | - | Details |
|
TE0803-02-03EG-1EB
IC MODULE ZYNQ USCALE 4GB 128MB
Trenz Electronic GmbH
|
9,522 | 580.00000 | Active | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 4GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C | Details |
|
TE0841-02-41C21-A
IC MODULE USCALE 2GB
Trenz Electronic GmbH
|
6,832 | 1816.88000 | Active | MCU, FPGA | Kintex UltraScale KU40 | - | - | 64MB | 2GB | B2B | 1.97" x 1.57" (50mm x 40mm) | 0°C ~ 70°C | Details |
|
TE0808-04-6BE21-L
IC MOD SOM MPSOC 4GB XCZU6EG
Trenz Electronic GmbH
|
3,382 | 1271.25000 | Active | MPU Core | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | - | 128MB | 4GB | B2B | 2.05" x 2.99" (52mm x 76mm) | 0°C ~ 85°C | Details |
|
PXF4333EV1.1
ABM 3G ATM BUFFER MANAGER
Infineon Technologies
|
840 | 148.67000 | Active | - | - | - | - | - | - | - | - | - | Details |
|
TE0745-02-71I31-AK
MOD SOM DDR3L 1GB HEAT SPREADER
Trenz Electronic GmbH
|
6,777 | 627.75000 | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7030) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.99" x 2.13" (76mm x 54mm) | -40°C ~ 85°C | Details |
|
TE0720-04-61Q33ML
IC SOC MODULE XILINX ZYNQ
Trenz Electronic GmbH
|
8,030 | 331.10000 | Active | Ethernet Core | ARM® Cortex®-A9 | - | - | 32MB | 1GB | Board-to-Board (BTB) Socket | 1.97" x 1.57" (50mm x 40mm) | -40°C ~ 85°C | Details |
|
MA-XU3-3EG-2I-D11-R3
SOM ZYNQ US+ ZU3EG 2GB
Enclustra FPGA Solutions
|
9,336 | 753.52000 | Active | - | - | - | - | - | - | - | - | - | Details |
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