XCVM2502-3HSEVSVI1760
XCVM2502-3HSEVSVI1760 is a Embedded - System On Chip (SoC) manufactured by AMD. XCVM2502-3HSEVSVI1760. Key specifications: operating temperature 0°C ~ 100°C (TJ), package / case 1760-BGA, FCBGA.
In Stock: 7,814
| Attribute | Value |
|---|---|
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz, 1.7GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.9M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| XCVE2002-2HSISBVA625 | AMD | XCVE2002-2HSISBVA625 | 100% | View |
| XCVM1302-2HSIVFVC1596 | AMD | IC VERSALPRIME ACAP FPGA 1596BGA | 100% | View |
| XCVP1002-2HSIVFVF1760 | AMD | XCVP1002-2HSIVFVF1760 | 100% | View |
| XCVM2302-3HSEVFVF1760 | AMD | XCVM2302-3HSEVFVF1760 | 100% | View |
| XCVP1102-3HSEVFVF1760 | AMD | XCVP1102-3HSEVFVF1760 | 100% | View |
| XCVP1202-3HSEVSVA2785 | AMD | IC VERSAL AI-CORE FPGA 2785BGA | 100% | View |
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