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XCVM2502-1LSEVSVI1760 - AMD - Embedded - System On Chip (SoC)

XCVM2502-1LSEVSVI1760

AMD

XCVM2502-1LSEVSVI1760

XCVM2502-1LSEVSVI1760 is a Embedded - System On Chip (SoC) manufactured by AMD. XCVM2502-1LSEVSVI1760. Key specifications: operating temperature 0°C ~ 100°C (TJ), package / case 1760-BGA, FCBGA.

In Stock: 4,347

Product Attributes

AttributeValue
ArchitectureMPU, FPGA
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDDR, DMA, PCIe
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed400MHz, 1GHz
Primary AttributesVersal™ Prime FPGA, 1.9M Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Grade-
Qualification-
Package / Case1760-BGA, FCBGA
Supplier Device Package1760-FCBGA (40x40)

Frequently Asked Questions

XCVM2502-1LSEVSVI1760 is a Embedded - System On Chip (SoC) manufactured by AMD. XCVM2502-1LSEVSVI1760

The operating temperature range of XCVM2502-1LSEVSVI1760 is 0°C ~ 100°C (TJ).

The package type of XCVM2502-1LSEVSVI1760 is 1760-BGA, FCBGA.

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