XCVM2302-1MSEVFVF1760
XCVM2302-1MSEVFVF1760 is a Embedded - System On Chip (SoC) manufactured by AMD. XCVM2302-1MSEVFVF1760. Key specifications: operating temperature 0°C ~ 100°C (TJ), supplier device package 1760-FCBGA (40x40).
In Stock: 1,143
| Attribute | Value |
|---|---|
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.575M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | - |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| 5CSXFC6C6U23C8NES | Intel | IC SOC CORTEX-A9 600MHZ 672UBGA | 100% | View |
| XCVE2102-1MSISBVA625 | AMD | XCVE2102-1MSISBVA625 | 100% | View |
| XCVE2102-2MSESFVA784 | AMD | XCVE2102-2MSESFVA784 | 100% | View |
| XCVM1102-2MSISFVA784 | AMD | XCVM1102-2MSISFVA784 | 100% | View |
| XCVM1502-2MSENFVB1369 | AMD | IC VERSALPRIME ACAP FPGA 1369BGA | 100% | View |
| XCVM2152-2MLINFVM1369 | AMD | IC FPGA VERSAL PRIME 1369BGA | 100% | View |
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