XCVM2302-1MLIVFVF1760
XCVM2302-1MLIVFVF1760 is a Embedded - System On Chip (SoC) manufactured by AMD. XCVM2302-1MLIVFVF1760. Key specifications: operating temperature -40°C ~ 110°C (TJ), supplier device package 1760-FCBGA (40x40).
In Stock: 4,594
| Attribute | Value |
|---|---|
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 600MHz, 1.3GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.575M Logic Cells |
| Operating Temperature | -40°C ~ 110°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | - |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| XCVP1002-1MLIVFVF1760 | AMD | XCVP1002-1MLIVFVF1760 | 100% | View |
| XCVM2502-1MSIVSVI1760 | AMD | XCVM2502-1MSIVSVI1760 | 100% | View |
| XCVM1502-2MLINFVB1369 | AMD | IC VERSALPRIME ACAP FPGA 1369BGA | 100% | View |
| XCVM2202-2MLINSVH1369 | AMD | XCVM2202-2MLINSVH1369 | 100% | View |
| XCVP1052-1MSINFVI1369 | AMD | XCVP1052-1MSINFVI1369 | 100% | View |
| XCVM1502-2MLIVFVC1760 | AMD | IC VERSALPRIME ACAP FPGA 1760BGA | 100% | View |
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