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XCVM2302-1LSIVFVF1760 - AMD - Embedded - System On Chip (SoC)

XCVM2302-1LSIVFVF1760

AMD

XCVM2302-1LSIVFVF1760

XCVM2302-1LSIVFVF1760 is a Embedded - System On Chip (SoC) manufactured by AMD. XCVM2302-1LSIVFVF1760. Key specifications: operating temperature -40°C ~ 110°C (TJ), supplier device package 1760-FCBGA (40x40).

In Stock: 1,647

Product Attributes

AttributeValue
ArchitectureMPU, FPGA
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDDR, DMA, PCIe
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed400MHz, 1GHz
Primary AttributesVersal™ Prime FPGA, 1.575M Logic Cells
Operating Temperature-40°C ~ 110°C (TJ)
Grade-
Qualification-
Package / Case-
Supplier Device Package1760-FCBGA (40x40)

Frequently Asked Questions

XCVM2302-1LSIVFVF1760 is a Embedded - System On Chip (SoC) manufactured by AMD. XCVM2302-1LSIVFVF1760

The operating temperature range of XCVM2302-1LSIVFVF1760 is -40°C ~ 110°C (TJ).

The package type of XCVM2302-1LSIVFVF1760 is 1760-FCBGA (40x40).

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