XCVM2302-1LSEVFVF1760
XCVM2302-1LSEVFVF1760 is a Embedded - System On Chip (SoC) manufactured by AMD. XCVM2302-1LSEVFVF1760. Key specifications: operating temperature 0°C ~ 100°C (TJ), supplier device package 1760-FCBGA (40x40).
In Stock: 7,108
| Attribute | Value |
|---|---|
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | 256KB |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 400MHz, 1GHz |
| Primary Attributes | Versal™ Prime FPGA, 1.575M Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | - |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| XCVM1802-1LSIVSVD1760 | AMD Xilinx | IC VERSAL AICORE FPGA 1760BGA | 100% | View |
| XCVC1902-1LSEVSVD1760 | AMD Xilinx | IC VERSAL AICORE FPGA 1760BGA | 100% | View |
| XCVE2002-1LSESBVA625 | AMD | XCVE2002-1LSESBVA625 | 100% | View |
| XCVE2002-1LSISBVA625 | AMD | XCVE2002-1LSISBVA625 | 100% | View |
| XCVM2502-1LLIVSVI1760 | AMD | XCVM2502-1LLIVSVI1760 | 100% | View |
| XCVP1402-1LLIVSVA2785 | AMD | IC VERSAL PREM ACAP FPGA 2785BGA | 100% | View |
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