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XCVM1402-2LLENSVF1369 - AMD - Embedded - System On Chip (SoC)

XCVM1402-2LLENSVF1369

AMD

IC VERSALPRIME ACAP FPGA 1369BGA

XCVM1402-2LLENSVF1369 is a Embedded - System On Chip (SoC) manufactured by AMD. IC VERSALPRIME ACAP FPGA 1369BGA. Key specifications: operating temperature 0°C ~ 100°C (TJ), package / case 1369-BFBGA, FCBGA.

In Stock: 6,841

Product Attributes

AttributeValue
ArchitectureMPU, FPGA
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size-
RAM Size-
PeripheralsDDR, DMA, PCIe
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed450MHz, 1.08GHz
Primary AttributesVersal™ Prime FPGA, 1.2M Logic Cells
Operating Temperature0°C ~ 100°C (TJ)
Grade-
Qualification-
Package / Case1369-BFBGA, FCBGA
Supplier Device Package1369-FCBGA (35x35)

Frequently Asked Questions

XCVM1402-2LLENSVF1369 is a Embedded - System On Chip (SoC) manufactured by AMD. IC VERSALPRIME ACAP FPGA 1369BGA

The operating temperature range of XCVM1402-2LLENSVF1369 is 0°C ~ 100°C (TJ).

The package type of XCVM1402-2LLENSVF1369 is 1369-BFBGA, FCBGA.

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