IC VERSALPRIME ACAP FPGA 1760BGA
XCVM1302-2HSIVSVD1760 is a Embedded - System On Chip (SoC) manufactured by AMD. IC VERSALPRIME ACAP FPGA 1760BGA. Key specifications: operating temperature -40°C ~ 100°C (TJ), package / case 1760-BFBGA, FCBGA.
In Stock: 2,885
| Attribute | Value |
|---|---|
| Architecture | MPU, FPGA |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| RAM Size | - |
| Peripherals | DDR, DMA, PCIe |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 800MHz, 1.65GHz |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Grade | - |
| Qualification | - |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| A3CY065BB18AI6S | Altera | FPGA AGILEX3 65KLE MIPI 474VPBGA | 100% | View |
| XCVM1502-2HSINFVB1369 | AMD | XCVM1502-2HSINFVB1369 | 100% | View |
| XCVP1002-2HSINFVI1369 | AMD | XCVP1002-2HSINFVI1369 | 100% | View |
| XCVC1702-2HSIVSVA2197 | AMD | XCVC1702-2HSIVSVA2197 | 100% | View |
| XCVC1802-2HSIVSVA2197 | AMD | IC VERSAL AI-CORE FPGA 2197BGA | 100% | View |
| XCVC1902-2HSIVIVA1596 | AMD | IC VERSAL AI-CORE FPGA 1596BGA | 100% | View |
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