RFQ List

No items in your RFQ list

Estimated Total: $0.00
View RFQ List
XCVC2602-1LLINSVH1369 - AMD - Embedded - System On Chip (SoC)

XCVC2602-1LLINSVH1369

AMD

XCVC2602-1LLINSVH1369

XCVC2602-1LLINSVH1369 is a Embedded - System On Chip (SoC) manufactured by AMD. XCVC2602-1LLINSVH1369. Key specifications: operating temperature -40°C ~ 110°C (TJ), package / case 1369-BFBGA, FCBGA.

In Stock: 9,666

Product Attributes

AttributeValue
ArchitectureMPU, FPGA
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size-
RAM Size256KB
PeripheralsDDR, DMA, PCIe
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed400MHz, 1GHz
Primary AttributesVersal™ AI Core FPGA, 820K Logic Cells
Operating Temperature-40°C ~ 110°C (TJ)
Grade-
Qualification-
Package / Case1369-BFBGA, FCBGA
Supplier Device Package1369-FCBGA (35x35)

Frequently Asked Questions

XCVC2602-1LLINSVH1369 is a Embedded - System On Chip (SoC) manufactured by AMD. XCVC2602-1LLINSVH1369

The operating temperature range of XCVC2602-1LLINSVH1369 is -40°C ~ 110°C (TJ).

The package type of XCVC2602-1LLINSVH1369 is 1369-BFBGA, FCBGA.

Alternative Products

Part NumberManufacturerDescriptionMatch
XCVE2102-1LLISBVA484 AMD XCVE2102-1LLISBVA484 100% View
XCVE2302-1LLISFVA784 AMD XCVE2302-1LLISFVA784 100% View
XCVM2152-1LLINFVD1024 AMD IC FPGA VERSAL PRIME 1024BGA 100% View
XCVM1502-1LSIVFVC1760 AMD IC VERSALPRIME ACAP FPGA 1760BGA 100% View
XCVC2602-1LSIVSVH1760 AMD XCVC2602-1LSIVSVH1760 100% View
XCVE2802-1LLINSVH1369 AMD XCVE2802-1LLINSVH1369 100% View

Related Products

Manufacturers in Embedded - System On Chip (SoC)

Need a Quote for This Part?

Submit your RFQ for XCVC2602-1LLINSVH1369 and get a quote within 24 hours.

Top
Live Chat
Hello! How can we help you today? Feel free to ask about pricing, availability, or technical details.