RFQ List

No items in your RFQ list

Estimated Total: $0.00
View RFQ List
XCS30-3BG256C - AMD Xilinx - Embedded - FPGAs (Field Programmable Gate Array)

XCS30-3BG256C

AMD Xilinx

IC FPGA 192 I/O 256BGA

XCS30-3BG256C is a Embedded - FPGAs (Field Programmable Gate Array) manufactured by AMD Xilinx. IC FPGA 192 I/O 256BGA. Key specifications: mounting type Surface Mount, operating temperature 0°C ~ 85°C (TJ), voltage - supply 4.75V ~ 5.25V, package / case 256-BBGA.

In Stock: 7,660

Product Attributes

AttributeValue
Product StatusObsolete
Number of LABs/CLBs576
Number of Logic Elements/Cells1368
Total RAM Bits18432
Number of I/O192
Number of Gates30000
Voltage - Supply4.75V ~ 5.25V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case256-BBGA
Supplier Device Package256-PBGA (27x27)

Frequently Asked Questions

XCS30-3BG256C is a Embedded - FPGAs (Field Programmable Gate Array) manufactured by AMD Xilinx. IC FPGA 192 I/O 256BGA

The mounting type of XCS30-3BG256C is Surface Mount.

The operating temperature range of XCS30-3BG256C is 0°C ~ 85°C (TJ).

The supply voltage of XCS30-3BG256C is 4.75V ~ 5.25V.

Yes, XCS30-3BG256C is listed as Obsolete. Consider requesting a quote for alternative parts.

Alternative Products

XCS30-3BG256C is Obsolete. Consider these compatible alternatives:

Part NumberManufacturerDescriptionMatch
XC4013E-4BG225C AMD Xilinx IC FPGA 192 I/O 225BGA 91% View
XC4013E-3PQ208I AMD Xilinx IC FPGA 160 I/O 208QFP 89% View
XC4013E-4HQ208I AMD Xilinx IC FPGA 160 I/O 208QFP 89% View
AGL060V5-VQ100 Microchip Technology IC FPGA 71 I/O 100VQFP 63% View
A3P060-FG144 Microchip Technology IC FPGA 96 I/O 144FBGA 60% View
LCMXO2-640HC-4TG100I Lattice Semiconductor Corporation IC FPGA 78 I/O 100TQFP 51% View

Related Products

Manufacturers in Embedded - FPGAs (Field Programmable Gate Array)

Need a Quote for This Part?

Submit your RFQ for XCS30-3BG256C and get a quote within 24 hours.

Top
Live Chat
Hello! How can we help you today? Feel free to ask about pricing, availability, or technical details.