RPMC SPIFLASH, 3V, 256M-BIT
W25R256JVFIQ is a Memory manufactured by Winbond Electronics. RPMC SPIFLASH, 3V, 256M-BIT. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 85°C (TA), voltage - supply 2.7V ~ 3.6V, package / case 16-SOIC (0.295", 7.50mm Width).
In Stock: 7,241
| Attribute | Value |
|---|---|
| Product Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 256Mb (32M x 8) |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 3ms |
| Access Time | 7 ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 16-SOIC (0.295", 7.50mm Width) |
| Supplier Device Package | 16-SOIC |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| W25Q01NWZEIQ | Winbond Electronics | SPIFLASH, 1G-BIT, 1.8V, 4KB UNIF | 95% | View |
| GD25Q64EYJGR | GigaDevice Semiconductor (HK) Limited | IC FLASH 64MBIT SPI/QUAD 8WSON | 82% | View |
| GD25Q64EWJGR | GigaDevice Semiconductor (HK) Limited | IC FLASH 64MBIT SPI/QUAD 8WSON | 82% | View |
| IS25LP032D-RHLA3-TR | ISSI, Integrated Silicon Solution Inc | 32MB QSPI, 24-BALL TFBGA 6X8MM 5 | 80% | View |
| IS25LP032D-RHLA3 | ISSI, Integrated Silicon Solution Inc | 32MB QSPI, 24-BALL TFBGA 6X8MM 5 | 80% | View |
| W25N512GWFIG | Winbond Electronics | 512MB SERIAL NAND FLASH, 1.8V | 68% | View |
Submit your RFQ for W25R256JVFIQ and get a quote within 24 hours.
3J LIMITED
