SPIFLASH, 3V, 256M-BIT, 4KB UNIF
W25Q256JVMIM is a Memory manufactured by Winbond Electronics. SPIFLASH, 3V, 256M-BIT, 4KB UNIF. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 85°C (TA), voltage - supply 2.7V ~ 3.6V, package / case 8-WLGA Exposed Pad.
In Stock: 7,130
| Attribute | Value |
|---|---|
| Product Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 256Mb (32M x 8) |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 3ms |
| Access Time | 6 ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-WLGA Exposed Pad |
| Supplier Device Package | 8-WFLGA (6x5) |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| S70FS01GSAGMFI010J | Spansion | 1 GB (128 MBYTE) 1.8V SPI FLASH | 90% | View |
| S25FS128SAGBHB203 | Infineon Technologies | IC FLASH 128MBIT SPI/QUAD 24BGA | 90% | View |
| W25Q256JWBIQ TR | Winbond Electronics | SPIFLASH, 1.8V, 256M-BIT, 4KB UN | 89% | View |
| GD25LQ80ETJGR | GigaDevice Semiconductor (HK) Limited | IC FLASH 8MBIT SPI/QUAD 8SOP | 76% | View |
| GD25LE255ELIGR | GigaDevice Semiconductor (HK) Limited | IC FLASH 256MBIT SPI/QUAD WLCSP | 76% | View |
| W25Q16DVUUBG | Winbond Electronics | IC FLASH | 72% | View |
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3J LIMITED
