3J LIMITED
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
LTN20069 is a Thermal - Heat Sinks manufactured by Wakefield-Vette. HEAT SINK BGA/PGA 16.5X16.5X8.9. Key specifications: material Aluminum.
In Stock: 6,535
Product Attributes
| Attribute | Value |
|---|---|
| Product Status | Active |
| Type | Board Level |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Shape | Square, Fins |
| Length | 0.650" (16.51mm) |
| Width | 0.653" (16.59mm) |
| Diameter | - |
| Fin Height | 0.350" (8.89mm) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 8.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural | - |
| Material | Aluminum |
| Material Finish | Black Anodized |
Frequently Asked Questions
LTN20069 is a Thermal - Heat Sinks manufactured by Wakefield-Vette. HEAT SINK BGA/PGA 16.5X16.5X8.9
The material of LTN20069 is Aluminum.
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