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TE0715-05-51I33-L - Trenz Electronic GmbH - Embedded - Microcontroller, Microprocessor, FPGA Modules

TE0715-05-51I33-L

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ XC7Z

TE0715-05-51I33-L is a Embedded - Microcontroller, Microprocessor, FPGA Modules manufactured by Trenz Electronic GmbH. SOC MODULE WITH XILINX ZYNQ XC7Z. Key specifications: operating temperature -40°C ~ 85°C, size / dimension 1.970" L x 1.570" W (50.00mm x 40.00mm), connector type Board-to-Board (BTB) Socket.

In Stock: 2

Product Attributes

AttributeValue
Module/Board TypeMPU Core
Core ProcessorZynq™ 7015 XC7Z015-1CLG485I
Co-ProcessorARM Cortex-A9
Speed-
Flash Size32MB
RAM Size1GB
Connector TypeBoard-to-Board (BTB) Socket
Size / Dimension1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature-40°C ~ 85°C

Frequently Asked Questions

TE0715-05-51I33-L is a Embedded - Microcontroller, Microprocessor, FPGA Modules manufactured by Trenz Electronic GmbH. SOC MODULE WITH XILINX ZYNQ XC7Z

The operating temperature range of TE0715-05-51I33-L is -40°C ~ 85°C.

The size of TE0715-05-51I33-L is 1.970" L x 1.570" W (50.00mm x 40.00mm).

The connector type of TE0715-05-51I33-L is Board-to-Board (BTB) Socket.

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