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66AK2L06XCMS - Texas Instruments - Embedded - DSP (Digital Signal Processors)

66AK2L06XCMS

Texas Instruments

IC SOC MULTICORE DSP+ARM 900BGA

66AK2L06XCMS is a Embedded - DSP (Digital Signal Processors) manufactured by Texas Instruments. IC SOC MULTICORE DSP+ARM 900BGA. Key specifications: mounting type Surface Mount, operating temperature 0°C ~ 100°C (TC), package / case 900-BFBGA, FCBGA, interface EBI/EMI, Ethernet, DMA, I²C, PCIe, SPI, UART/USART, USB 3.0, USIM.

In Stock: 2,907

Product Attributes

AttributeValue
Product StatusActive
TypeDSP+ARM®
InterfaceEBI/EMI, Ethernet, DMA, I²C, PCIe, SPI, UART/USART, USB 3.0, USIM
Clock Rate1GHz
Non-Volatile MemoryROM (384kB)
On-Chip RAM5.384MB
Voltage - I/O0.85V, 1.0V, 1.8V, 3.3V
Voltage - CoreVariable
Operating Temperature0°C ~ 100°C (TC)
Mounting TypeSurface Mount
Package / Case900-BFBGA, FCBGA
Supplier Device Package900-FCBGA (25x25)

Frequently Asked Questions

66AK2L06XCMS is a Embedded - DSP (Digital Signal Processors) manufactured by Texas Instruments. IC SOC MULTICORE DSP+ARM 900BGA

The mounting type of 66AK2L06XCMS is Surface Mount.

The operating temperature range of 66AK2L06XCMS is 0°C ~ 100°C (TC).

The package type of 66AK2L06XCMS is 900-BFBGA, FCBGA.

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