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ED18DT - On Shore Technology Inc. - Sockets for ICs, Transistors

ED18DT

On Shore Technology Inc.

CONN IC DIP SOCKET 18POS TIN

ED18DT is a Sockets for ICs, Transistors manufactured by On Shore Technology Inc.. CONN IC DIP SOCKET 18POS TIN. Key specifications: mounting type Through Hole, operating temperature -55°C ~ 110°C, housing material Polybutylene Terephthalate (PBT), Glass Filled, termination Solder.

In Stock: 6,190

Product Attributes

AttributeValue
Product StatusActive
TypeDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)18 (2 x 9)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingTin
Contact Finish Thickness - Mating60.0µin (1.52µm)
Contact Material - MatingPhosphor Bronze
Mounting TypeThrough Hole
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post60.0µin (1.52µm)
Contact Material - PostPhosphor Bronze
Housing MaterialPolybutylene Terephthalate (PBT), Glass Filled
Operating Temperature-55°C ~ 110°C

Frequently Asked Questions

ED18DT is a Sockets for ICs, Transistors manufactured by On Shore Technology Inc.. CONN IC DIP SOCKET 18POS TIN

The mounting type of ED18DT is Through Hole.

The operating temperature range of ED18DT is -55°C ~ 110°C.

The material of ED18DT is Polybutylene Terephthalate (PBT), Glass Filled.

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