SYSTEM-IN-PACKAGE: AMD ZYNQ ULTR
OSDZU3EG1-2G-BFB is a Embedded - Microcontroller, Microprocessor, FPGA Modules manufactured by Octavo Systems LLC. SYSTEM-IN-PACKAGE: AMD ZYNQ ULTR. Key specifications: operating temperature 0°C ~ 85°C, size / dimension 1.570" L x 0.807" W (40.00mm x 20.50mm), connector type 600-BGA.
In Stock: 5,931
| Attribute | Value |
|---|---|
| Module/Board Type | MPU Core |
| Core Processor | ARM® Cortex®-R5F, ARM® Quad Cortex®-A53 |
| Co-Processor | - |
| Speed | 500MHz, 1.2GHz |
| Flash Size | 128MB |
| RAM Size | 2GB |
| Connector Type | 600-BGA |
| Size / Dimension | 1.570" L x 0.807" W (40.00mm x 20.50mm) |
| Operating Temperature | 0°C ~ 85°C |
| Part Number | Manufacturer | Description | Match | |
|---|---|---|---|---|
| ATSAMA5D27-WLSOM1 | Microchip Technology | SAMA5D2 WIRELESS SOM | 100% | View |
| 100-1217-1 | BECOM Systems GmbH | IC MOD ADSP-BF609 500MHZ X 2 | 100% | View |
| SOMLX800-11-000GCR-A | Beacon EmbeddedWorks | IC MODULE GEODE LX800 500MHZ | 100% | View |
| SOMLX800-11-000GCR | Beacon EmbeddedWorks | IC MODULE GEODE LX800 500MHZ | 100% | View |
| SOMLX800-11-000GC | Beacon EmbeddedWorks | IC MODULE GEODE LX800 500MHZ | 100% | View |
| OSDZU3EG1-2G-IFA | Octavo Systems LLC | SYSTEM-IN-PACKAGE: AMD ZYNQ ULTR | 100% | View |
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