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TDA18264HB/C1 - NXP USA Inc. - Interface - Telecom

TDA18264HB/C1

NXP USA Inc.

INTEGRATED CIRCUIT

TDA18264HB/C1 is a Interface - Telecom manufactured by NXP USA Inc.. INTEGRATED CIRCUIT. Key specifications: mounting type Surface Mount, package / case 80-TFQFN Exposed Pad, power (watts) 2.55 W, number of circuits 16.

In Stock: 1,945

Product Attributes

AttributeValue
Product StatusObsolete
FunctionTransceiver
Interface-
Number of Circuits16
Voltage - Supply-
Current - Supply-
Power (Watts)2.55 W
Operating Temperature-
Mounting TypeSurface Mount
Package / Case80-TFQFN Exposed Pad
Supplier Device Package80-HTQFNR-EP (12x12)

Frequently Asked Questions

TDA18264HB/C1 is a Interface - Telecom manufactured by NXP USA Inc.. INTEGRATED CIRCUIT

The mounting type of TDA18264HB/C1 is Surface Mount.

The package type of TDA18264HB/C1 is 80-TFQFN Exposed Pad.

The power rating of TDA18264HB/C1 is 2.55 W.

The circuit configuration of TDA18264HB/C1 is 16.

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