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MIMX9352DVVXMAC - NXP USA Inc. - Embedded - Microprocessors

MIMX9352DVVXMAC

NXP USA Inc.

I.MX93 BGA11

MIMX9352DVVXMAC is a Embedded - Microprocessors manufactured by NXP USA Inc.. I.MX93 BGA11. Key specifications: mounting type Surface Mount, operating temperature 0°C ~ 95°C (TJ), package / case 306-LFBGA.

In Stock: 2,979

Product Attributes

AttributeValue
Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width2, 1 Core, 64-Bit
Speed250MHz, 1.7GHz
Co-Processors/DSPMultimedia; NEON™ MPE, NPU
RAM ControllersLPDDR4
Graphics AccelerationNo
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet10/100/1000Mbps (2)
SATA-
USBUSB 2.0 OTG (2)
Voltage - I/O1.8V
Operating Temperature0°C ~ 95°C (TJ)
Grade-
Qualification-
Security FeaturesBoot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting TypeSurface Mount
Package / Case306-LFBGA
Supplier Device Package306-LFBGA (11x11)
Additional InterfacesCANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART

Frequently Asked Questions

MIMX9352DVVXMAC is a Embedded - Microprocessors manufactured by NXP USA Inc.. I.MX93 BGA11

The mounting type of MIMX9352DVVXMAC is Surface Mount.

The operating temperature range of MIMX9352DVVXMAC is 0°C ~ 95°C (TJ).

The package type of MIMX9352DVVXMAC is 306-LFBGA.

Alternative Products

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MIMX9352XVVXMACR NXP USA Inc. I.MX93 BGA11 100% View
MIMX9351XVVXMAC NXP USA Inc. I.MX93 BGA11 100% View
MIMX9332CVTXMAB NXP USA Inc. MIMX9332CVTXMAB 100% View

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