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MIMX9301CVVXDACR - NXP USA Inc. - Embedded - Microprocessors

MIMX9301CVVXDACR

NXP USA Inc.

I.MX93 BGA11

MIMX9301CVVXDACR is a Embedded - Microprocessors manufactured by NXP USA Inc.. I.MX93 BGA11. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 105°C (TJ), package / case 306-LFBGA.

In Stock: 9,069

Product Attributes

AttributeValue
Core ProcessorARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width1, 1 Core, 64-Bit
Speed900MHz, 250MHz
Co-Processors/DSPMultimedia; NEON™ MPE
RAM ControllersLPDDR4
Graphics AccelerationNo
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet10/100/1000Mbps (2)
SATA-
USBUSB 2.0 OTG (2)
Voltage - I/O1.8V
Operating Temperature-40°C ~ 105°C (TJ)
Grade-
Qualification-
Security FeaturesBoot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting TypeSurface Mount
Package / Case306-LFBGA
Supplier Device Package306-LFBGA (11x11)
Additional InterfacesCANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART

Frequently Asked Questions

MIMX9301CVVXDACR is a Embedded - Microprocessors manufactured by NXP USA Inc.. I.MX93 BGA11

The mounting type of MIMX9301CVVXDACR is Surface Mount.

The operating temperature range of MIMX9301CVVXDACR is -40°C ~ 105°C (TJ).

The package type of MIMX9301CVVXDACR is 306-LFBGA.

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