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LPC55S66JEV59E - NXP USA Inc. - Embedded - Microcontrollers

LPC55S66JEV59E

NXP USA Inc.

IC

LPC55S66JEV59E is a Embedded - Microcontrollers manufactured by NXP USA Inc.. IC. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 105°C (TA), voltage - supply (vcc/vdd) 1.8V ~ 3.6V, package / case 59-VFBGA.

In Stock: 3,557

Product Attributes

AttributeValue
DigiKey Programmable-
Core ProcessorARM® Cortex®-M33F
Core Size32-Bit
Speed150MHz
ConnectivityFlexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
PeripheralsAES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Number of I/O37
Program Memory Size256KB (256K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size144K x 8
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V
Data ConvertersA/D 10x16b SAR
Oscillator TypeExternal, Internal
Operating Temperature-40°C ~ 105°C (TA)
Grade-
Qualification-
Mounting TypeSurface Mount
Supplier Device Package59-VFBGA (4x4)
Package / Case59-VFBGA

Frequently Asked Questions

LPC55S66JEV59E is a Embedded - Microcontrollers manufactured by NXP USA Inc.. IC

The mounting type of LPC55S66JEV59E is Surface Mount.

The operating temperature range of LPC55S66JEV59E is -40°C ~ 105°C (TA).

The supply voltage of LPC55S66JEV59E is 1.8V ~ 3.6V.

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