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LPC55S06JBD64E - NXP USA Inc. - Embedded - Microcontrollers

LPC55S06JBD64E

NXP USA Inc.

IC MCU 32BIT 256KB FLASH 64HTQFP

LPC55S06JBD64E is a Embedded - Microcontrollers manufactured by NXP USA Inc.. IC MCU 32BIT 256KB FLASH 64HTQFP. Key specifications: mounting type Surface Mount, operating temperature -40°C ~ 105°C (TA), voltage - supply (vcc/vdd) 1.8V ~ 3.6V, package / case 64-TQFP Exposed Pad.

In Stock: 6,710

Product Attributes

AttributeValue
Product StatusActive
Core ProcessorARM® Cortex®-M33
Core Size32-Bit Single-Core
Speed96MHz
ConnectivityCANbus, Flex COMM, I²C, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O45
Program Memory Size256KB (256K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size96K x 8
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V
Data ConvertersA/D 9x16b SAR
Oscillator TypeInternal
Operating Temperature-40°C ~ 105°C (TA)
Mounting TypeSurface Mount
Package / Case64-TQFP Exposed Pad
Supplier Device Package64-HTQFP (10x10)

Frequently Asked Questions

LPC55S06JBD64E is a Embedded - Microcontrollers manufactured by NXP USA Inc.. IC MCU 32BIT 256KB FLASH 64HTQFP

The mounting type of LPC55S06JBD64E is Surface Mount.

The operating temperature range of LPC55S06JBD64E is -40°C ~ 105°C (TA).

The supply voltage of LPC55S06JBD64E is 1.8V ~ 3.6V.

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