RFQ List

No items in your RFQ list

Estimated Total: $0.00
View RFQ List
LMC6572BIN - National Semiconductor - Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps

LMC6572BIN

National Semiconductor

IC OPAMP GP 2 CIRCUIT 8MDIP

LMC6572BIN is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps manufactured by National Semiconductor. IC OPAMP GP 2 CIRCUIT 8MDIP. Key specifications: mounting type Through Hole, operating temperature -40°C ~ 85°C (TJ), package / case 8-DIP (0.300", 7.62mm), current - supply 160µA (x2 Channels).

In Stock: 5,043

Product Attributes

AttributeValue
Product StatusObsolete
Amplifier TypeGeneral Purpose
Number of Circuits2
Output TypePush-Pull, Rail-to-Rail
Slew Rate0.09V/µs
Gain Bandwidth Product220 kHz
-3db Bandwidth-
Current - Input Bias10 pA
Voltage - Input Offset500 µV
Current - Supply160µA (x2 Channels)
Current - Output / Channel6 mA
Voltage - Supply Span (Min)2.7 V
Voltage - Supply Span (Max)11 V
Operating Temperature-40°C ~ 85°C (TJ)
Mounting TypeThrough Hole
Package / Case8-DIP (0.300", 7.62mm)
Supplier Device Package8-MDIP

Frequently Asked Questions

LMC6572BIN is a Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps manufactured by National Semiconductor. IC OPAMP GP 2 CIRCUIT 8MDIP

The mounting type of LMC6572BIN is Through Hole.

The operating temperature range of LMC6572BIN is -40°C ~ 85°C (TJ).

The package type of LMC6572BIN is 8-DIP (0.300", 7.62mm).

The circuit configuration of LMC6572BIN is 2.

Alternative Products

LMC6572BIN is Obsolete. Consider these compatible alternatives:

Part NumberManufacturerDescriptionMatch
LMC6574AIN National Semiconductor IC OPAMP GP 4 CIRCUIT 14DIP 97% View
LMC6574BIN National Semiconductor IC OPAMP GP 4 CIRCUIT 14DIP 97% View

Related Products

Manufacturers in Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps

Need a Quote for This Part?

Submit your RFQ for LMC6572BIN and get a quote within 24 hours.

Top
Live Chat
Hello! How can we help you today? Feel free to ask about pricing, availability, or technical details.