ATSAMHA0G17A-MZT-BVAO
LIN SYSTEM IN PACKAGE SIP (MCU +
ATSAMHA0G17A-MZT-BVAO is a Embedded - Microcontrollers manufactured by Microchip Technology. LIN SYSTEM IN PACKAGE SIP (MCU +. Key specifications: mounting type Surface Mount, Wettable Flank, operating temperature -40°C ~ 115°C (TC), voltage - supply (vcc/vdd) 5V ~ 28V, package / case 48-VFQFN Exposed Pad.
In Stock: 7,435